Lam Research
590
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedIn a typical reactive-ion etch (RIE) process, the wafer is placed on a powered electrode. The plasma generates ions that accelerate toward the wafer, providing both chemical etching via reactive species and physical sputtering. The Lam 590, like other RIE tools, allows control over gas composition, pressure, power, and temperature to achieve anisotropic or isotropic etch profiles.
Where it fits in the process flow
General reference — not yet source-verifiedThe Lam 590 is used in the etch module of a semiconductor fabrication line. After photolithography defines a pattern in photoresist, the etcher transfers that pattern into the underlying film—such as oxide, nitride, or polysilicon—by removing material from unmasked areas. The etched wafer then moves to a resist strip or cleaning step before subsequent processing.
What do the numbers mean?
Power & electrical4
Vacuum & pumping1
Wafer handling1
Gas & chemistry2
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- wet_etch_121500.pdfDocumentumd.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 590 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 590 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 590 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 590 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 590 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 590 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
- [4]Lam Research Autoetch 590 - Rebuilt Plasma Etcher — spwindustrial.comspwindustrial.com
Last updated Oct 3, 2026.
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