Waferpedia

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Waferpedia

Every entry is sourced. Filter by manufacturer, process category, wafer size, and lifecycle stage.

10070 entries

  1. HVM1MRSI

    MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

    CategoryPackaging & Bonding
    14 specs
  2. UV360Despatch
    CategoryUltraviolet decontamination chamber
    6 specs
  3. XP8ASM

    ASM XP8 is a registered trademark in ASM's product portfolio.

    1 spec
  4. ALU 2150 PartsAsyst
    CategoryLab & Support Equipment
    1 spec
  5. 11729 C Carrier Noise Test SetAgilent

    The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.

    CategoryTest & Probe
    2 specs
  6. PD3Edwards

    The Edwards PD3 plate degasser is a vacuum coating system for degassing photographic films and plates before use in electron microscopes.

    CategoryVacuum coating system
    15 specs
  7. 901GTegal

    The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.

    CategoryEtchWafer75 mm to 150 mm round substrates; square and rectangular substrates
    10 specs
  8. EG 6000 eElectroglas

    The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.

    CategoryTest & Probe
  9. 0720 00748 PartApplied Materials
    1 spec
  10. 1250Therma-Wave
    4 specs
  11. F80-AFilmetrics

    The Filmetrics F80-A is a film thickness mapping tool for patterned wafers that combines full F80 functionality with Ricmar's WTT 300 Wafer Transfer Tool in a single EFEM platform.

    CategoryFilm thickness mapping tool
    3 specs
  12. 175MRSI

    The MRSI-175Ag is a servo-controlled conductive epoxy dispenser with two configurable heads and Windows Workcell software.

    CategoryConductive epoxy dispenser
    12 specs
  13. S-96MWSignatone

    The Signatone S-96MW is a micropositioner.

    CategoryMicropositioner
    1 spec
  14. 0720 14337 PartApplied Materials
    1 spec
  15. SDC5600Sonix

    The Sonix SDC5600 is a Motorola DSP56002-based digital signal processing board for IBM compatible computers.

    CategoryDigital signal processing board
    6 specs
  16. HD8000Wyko

    The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.

    CategoryPrecision Optics
    12 specs
  17. 3CKTemescal

    Temescal Model 3CK SuperSource is a removable-cover multi-pocket electron-beam source rated up to 12 kW.

    CategoryE-gun
    20 specs
  18. S 9200Hitachi

    The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.

    CategoryMetrology & Inspection
    14 specs
  19. 3PTTemescal

    The Temescal 3PT is a PopTop multi-pocket electron-beam source rated up to 12 kW.

    Categoryelectron beam source
    21 specs
  20. 101EV Group

    The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

    CategoryLithography
    15 specs
  21. KMR3Leica

    Leica KMR3 is a glass knifemaker used for trimming and rough cutting specimens.

    CategoryMicrotome
    3 specs
  22. V-20Canon

    Canon is a manufacturer that produces semiconductor manufacturing equipment, including photolithography equipment such as steppers and scanners.

    4 specs
  23. 91159Newport

    The Newport Model 91159 is a full spectrum solar simulator that produces power equivalent to about 1 sun.

    CategorySolar Cell Simulator
    7 specs
  24. 150Cascade Microtech
    Wafer150mm
    2 specs
  25. 600iNova

    The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.

    CategoryMetrology & Inspection
    21 specs
  26. DM2700Leica

    The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.

    CategoryMetrology & Inspection
    20 specs
  27. TCP 9400 ICPLam Research

    The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.

    CategoryEtch
    3 specs
  28. 306OAI

    The OAI 306 is a handheld UV power meter (radiometer) made by Optical Associates Inc. for measuring ultraviolet light intensity in real time.

    CategoryUV intensity meter
    10 specs
  29. 880Zeiss

    The Zeiss LSM 880 is a laser scanning confocal microscope.

    9 specs
  30. NT1100Wyko

    The Wyko NT1100 is an optical profiler in the Wyko optical profiler product line.

    CategoryPrecision Optics
    4 specs
  31. PB6YES

    The YES-PB6 was a tabletop vacuum cure system in the PB Series, and support for it was discontinued effective January 1, 2021.

    CategoryTabletop vacuum curing system
    Discontinued6 specs
  32. 0620 05691 PartApplied Materials
    CategoryLab & Support Equipment
    1 spec
  33. A 8 S ZATokyo Electron

    The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.

    CategoryThermal / Diffusion
    11 specs
  34. Axioscope 5Zeiss

    The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.

    CategoryMetrology & Inspection
    11 specs
  35. 11000Cascade Microtech
    CategoryTest & Probe
    11 specs
  36. D500iSouth Bay Technology

    The South Bay Technology D500i is a dimpler used for dimple grinding samples for transmission electron microscopy (TEM).

    CategoryDimpler
    13 specs
  37. SP3200Wyko

    The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.

    CategoryPackaging & Bonding
    14 specs
  38. Pfeiffer TPG 300 Pressure ControllerBalzers

    The Balzers Pfeiffer TPG 300 Pressure Controller is a pressure controller that includes an IKR 020 gauge.

    CategoryLab & Support Equipment
    2 specs
  39. 6 AI-DC 6Strasbaugh

    The Strasbaugh 6 AI-DC 6 is a polisher.

    CategoryCMP
  40. CV200YES

    The CV200RF Series is a plasma strip/descum system line with automated wafer handling, used for photoresist removal, polyimide removal, organics removal, CD master cleaning, and descum processes.

    CategoryPlasma Strip/Descum System
    10 specs
  41. F20-EXRFilmetrics

    The Filmetrics F20-EXR uses spectral reflectance for measuring ITO thickness and other display-layer films.

    Categorythin-film thickness measurement instrument
    4 specs
  42. EPM75Edwards

    The Edwards EPM75 is a planar magnetron sputtering source for vacuum coating systems.

    CategoryCoating component
    7 specs
  43. 288DEK

    The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.

    CategoryAssembly / SMT
    55 specs
  44. 340 D Helium Leak DetectorASM
    CategoryLab & Support Equipment
    5 specs
  45. 12-2P-CPYES

    The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.

    CategoryThermal / DiffusionWafer300mm
    12 specs
  46. Contura X 700 X 1000 MeasuringZeiss

    The Zeiss Contura X 700 / X 1000 is a measuring machine manufactured by Zeiss.

  47. 3600GCA
    CategoryPattern Generator
    1 spec
  48. WS-1000MHLaurell

    The Laurell WS-1000MH is a mini wet station in the WS-1000MH series of mini spin-process stations.

    CategoryMini wet station
    19 specs
  49. 3TAYES

    YES-3TA is a Vacuum Bake / Vapor Prime system in the YES Vacuum Bake/Vapor Prime product line, with capacity for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers.

    CategoryThermal / DiffusionWafer4 in, 5-6 in, 8 in, 12 in
    8 specs
  50. R50Filmetrics

    The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.

    CategoryMetrology & InspectionWafer200mm
    7 specs
  51. Galaxy S5Samsung

    The Samsung Galaxy S5 is an Android smartphone announced in February 2014 and released in April 2014, featuring a 5.1-inch Super AMOLED display, a 16 MP rear camera, and IP67 dust/water resistance.

    21 specs
  52. M5MRSI

    The MRSI-M5 is an assembly work cell for precision automation and advanced assembly tasks including epoxy die attach, eutectic bonding, and flip chip bonding.

    CategoryAssembly Work Cell
    18 specs
  53. ST 260 SRDSemitool

    The Semitool ST 260 SRD is a spin rinse dryer designed for processing 2-inch wafers.

    2 specs
  54. 3DRaith

    Raith eLINE Plus is a multi-technique electron beam lithography and nanoengineering system with an open, upgradable platform and integrated nanomanipulation and focused electron beam induced process capabilities.

    CategoryNanoengineering EBL tool
    7 specs
  55. FF20YXLON

    The YXLON FF20 CT is a high-precision industrial computed tomography system for electronic applications and small-scale electronics components.

    CategoryCT system
    12 specs
  56. 7645Specialty Coating Systems
    CategoryParylene coater
    3 specs
  57. 60MWDespatch

    Der Despatch 60MW ist ein Trocken/Brennofen mit infraroter Heiztechnik, ausgelegt für hohe Durchsatzleistung, konsistente Prozessreproduzierbarkeit und maximale Betriebslaufzeit.

    CategoryInfrarot-Ofentrockner / Brennofen
    10 specs
  58. DBM 2706 Atmospheric Wafer Handling RobotBrooks

    The Brooks / PRI DBM 2706 is an atmospheric wafer handling robot with a dual-arm configuration.

    CategoryLab & Support Equipment
    1 spec
  59. LCD1-16NV-3Despatch

    The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

    CategoryThermal / DiffusionWafer100mm
    15 specs
  60. SERV.470.54502ASML
    CategoryWet Processing / Clean
    6 specs