Waferpedia

YES

3TA

Thermal / Diffusion4 in, 5-6 in, 8 in, 12 inIntroduced Produced 1980–YES 3TA family
Research Quality: 50% complete

The YES 3TA is a Vacuum Bake / Vapor Prime system. The YES 3TA is specified for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers. The YES 3TA is specified for throughput of 2 full loads per hour.[1][2]

YES3TA
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  • Plate 01Yield Engineering YES-3TA Vapor Prime Oven #58252

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  • Plate 02Yield Engineering YES-3TA Vapor Prime Oven #58252

    Bid ServicellcWatch on YouTube

Wafer size

4 in, 5-6 in, 8 in, 12 in

Produced

1980–

Vacuum

Vacuum Bake / Vapor Prime Systems[3]

Performance

2 full loads/hr[1]

What it is

The YES 3TA is a vacuum bake and vapor prime system for semiconductor wafer processing. The YES 3TA belongs to Yield Engineering Systems' dual function vacuum bake and vapor prime product line.[3][1]

How it works

The YES 3TA provides a pre-programmed dehydration and vapor deposition environment for a priming agent. The YES 3TA combines vacuum bake functions with vapor priming in a single batch process chamber.[1]

The YES 3TA operates at a maximum temperature of 160 C. The YES 3TA has a capacity of 8 cassettes of 4-inch wafers or 1 cassette of 5-inch to 8-inch wafers.[1]

Where it fits in the process flow

General reference — not yet source-verified

The YES 3TA sits ahead of organic coating and other surface-sensitive downstream steps. The YES 3TA is used for dehydration and priming so later process layers can adhere more uniformly.

The YES 3TA is used in batch processing environments where wafer adhesion and surface conditioning matter. The YES 3TA is suitable for flows that need a primed hydrophobic surface before subsequent lithography-related processing.

Applications

The YES 3TA is used for semiconductor wafer dehydration and vapor priming. The YES 3TA is intended for priming agents such as HMDS.[1]

  • pre-programmed dehydration
  • vapor deposition of a priming agent

What do the numbers mean?

Vacuum & pumping2

Category
Vacuum Bake / Vapor Prime Systems[3]
Accurate?
Process type
Vacuum Bake / Vapor Prime[1]
Accurate?

Wafer handling3

Capacity
8 cassettes of 4-inch wafers, or 1 cassette of 5-8 inch wafers[1]
Accurate?
Cleanliness
less than 10x1 micron particles per 4-inch wafer[1]
Accurate?
HMDS usage
<4 ml/200 wafers (120 prime cycles/pint)[1]
Accurate?

Performance1

Throughput
2 full loads/hr[1]
Accurate?

Configuration & options2

Model
YES-3TA[3]
Accurate?
Temperature
160°C max[1]
Accurate?

Vintage & configurations

  1. 1980Production start[1]

    Vacuum Bake / Vapor Prime was the first product YES produced back in 1980.

Documented models & variants

DesignationGenerationVintageChangesSource
YES-5TA——Specified for 8 cassettes of 5-6 inch wafers, or 2 cassettes of 8 inch wafers, or 1 cassette of 12 inch wafers.web.archive.org[1]
YES-15——Specified as an 'Ultra-Clean' system with capacity for 8 cassettes of 4 inch wafers, or 1 cassette of 5-8 inch wafers.web.archive.org[1]
YES-6112——Specified as an 'Ultra-Clean' system with capacity for 4 cassettes of 8 inch wafers.web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • CategoryVacuum Bake / Vapor Prime Systems[3]
  • Process typeVacuum Bake / Vapor Prime[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the YES 3TA used for?

The YES 3TA is used for vacuum bake and vapor prime processing on semiconductor wafers.[3][1]

What wafer capacity does the YES 3TA have?

The YES 3TA has a capacity of 8 cassettes of 4-inch wafers, or 1 cassette of 5-inch to 8-inch wafers.[1]

Not publicly documented

The following facts about the 3TA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • The control-system platform and OS era of the 3TA are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 3TA are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 3TA is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 3TA are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 3TA are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]Image Reversal Product Specification Chart — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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