Etch

The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.

The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.

Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.

The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Applied Materials Centura DPS Poly Etcher is a decoupled plasma source etching tool for 6-inch wafers.

The SEZ 203 Spin Processor is an 8-inch spin etcher.

The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

The Applied Materials Centura TPCC RTP XE+ is an etcher designed for 8-inch wafers.

The Tokyo Electron Unity II E 855 SS is an etcher for 8-inch wafers.

The Ulvac NE 5500 is an etch tool used in semiconductor manufacturing.

The Oxford PlasmaPro 100 Cobra is an etcher with 8 inch wafer size, an ICP chamber with Cl2 and BCl3 capability, and three RIE chambers.

The Lam Research 590 is a plasma etcher.

The SPTS Rapier is an optimized deep reactive ion etching (DRIE) system for silicon and silicon-on-insulator wafers.

The SPTS Synapse is an ICP-based high-density plasma etcher dedicated to etching SiO2 and SixNy layers.

The Lam Alliance A 6 Exelan HPT is a dielectric etch system for 8-inch wafers, equipped with Exelan HPT chambers and a 4520 chamber.

TEL Unity Me is an automatic plasma etching production tool from Tokyo Electron, configured at CMi with a 100mm wafer cassette loader, a transfer chamber, and a DRM process module.

The SEZ SP 323 is a single-wafer wet chemical processor used for spin etching in semiconductor manufacturing.

The Tel Unity II E 85 DD is an 8-inch oxide etch system.

The Nordson March AP 300 is a plasma system with a 300 Watt, 13.56 MHz RF generator and an integrated RF automated tuning network assembly.

The Lam Research TCP 9600 is a dry etch system for metal etching, designed for 200 mm wafers.

The Tepla GiGAbatch is a high-frequency plasma tool used for photoresist stripping, wafer surface cleaning, and descumming before wet etching.

The Applied Materials CENG 2 is a dry etcher used in semiconductor manufacturing.

The Lam/SEZ 201 Backside Etcher is a backside etching tool for 8-inch wafers.

The Lam Research TCP 9400 SE is an inductively coupled plasma etch system used for polysilicon/polycide etch and shallow trench isolation.

The Lam Research 2300 Versys Kiyo Polysilicon Etch is a 300mm wafer plasma etch system designed for polysilicon etching.

The Applied Materials Centura DPS 2 G 5 is a semiconductor etcher with Metal 3ch and Axiom 1ch configuration, manufactured in 2008.

The Lam 2300 e 5 Kiyo is a three-chamber plus one-strip etch system.

The Lam 2300 V 2 Versys Kiyo 45 is a 12-inch polysilicon etch system.

Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.

The Applied Materials Centura AP DPS AdvantEdge G 2 Metal is a metal etch system designed for 12 inch wafers.

The Applied Materials Centura AP AdvantEdge G 5 Metal is a 300 mm metal etch system.

The Veeco Nexus IBE350 is a broad-beam ion etcher with a 350 mm Argon ion source, three-grids ion optics, and SIMS endpoint detection.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

The Tegal i90X is a plasma etch system based on the production-proven Tegal 900-series platform, with unlimited recipes, 20X fine set-point control, and a Windows NT touchscreen control system.

The Lam 2300 e 5 Exelan Flex FX is a dielectric etch system for 12-inch wafers.

The Tel VIGSRK Dry Etcher is a dry etching system.

The Plasma-Therm 790 RIE is a reactive ion etch system configured for silicon substrate processing.

The Branson IPC 4000 C is a plasma etcher.

The Lam / SEZ 203 is a spin processor used for wet etching and backside cleaning of 200mm wafers.

Applied Materials Enabler is a dielectric etch tool configured for 300 mm wafers.

The Applied Materials Centura 5200 DPS Metal is a metal etching system with a decoupled plasma source, processing 6-inch wafers.

The Tegal 9XX is a series of etchers.

The Tegal 903 is an etcher in the Tegal 9XX Series Etchers.

The Tegal 703 is a plasma inline etcher mentioned in equipment and parts listings.

The Tegal 703 RPPS is a plasma inline etcher referenced in source material from Tegal equipment listings.

The Tokyo Electron Tactras RLSA Process is an etch process chamber for 12-inch wafers used for poly etch.

Oxford Instruments Plasmalab 80 Plus RIE is a reactive ion etcher with support for wafers up to 8 inches.

The Lam Research 2300 Exelan is a dielectric etch system for 300mm wafers, validated for sub-65-nm front- and backend applications.

The Tokyo Electron TACVESNV is a dry etcher used in semiconductor manufacturing.

The Lam / SEZ RST 201 Spin is a spin etcher designed for 6-inch wafers, with a reported vintage of 1997.