Lam Research
2300 Exelan Dielectric
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam Research 2300 Exelan is a dielectric etch system for 300mm wafers. The 2300 Exelan demonstrated capability for sub-65-nm front- and backend applications, including HARC and dual damascene processes.[1]
What it is
The Lam Research 2300 Exelan is a dielectric etch system designed for 300 mm (12-inch) wafers.[2]
How it works
The 2300 Exelan uses Dual Frequency Confined (DFC) plasma technology. DFC provides two independent radio-frequency sources for process flexibility. The plasma is confined within the chamber to eliminate memory effects. The system includes in situ Waferless AutoCleans to maintain chamber cleanliness between wafers.[4][1]
Where it fits in the process flow
Applications
General reference — not yet source-verifiedThe system targets critical dielectric etch applications for advanced logic and memory devices. Dielectric etch processes define contact holes, via openings, and trench patterns in insulating layers.
What do the numbers mean?
Wafer handling1
Optics & imaging1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the 2300 Exelan support?
The 2300 Exelan supports 300 mm (12-inch) wafers.[2]
What plasma technology does the 2300 Exelan use?
The system uses Dual Frequency Confined (DFC) plasma technology.[4][1]
Not publicly documented
The following facts about the 2300 Exelan Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 Exelan Dielectric are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 Exelan Dielectric are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 Exelan Dielectric are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 Exelan Dielectric is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]newsroom.lamresearch.com — newsroom.lamresearch.comnewsroom.lamresearch.com
- [2]Equipment inventory listing
- [3]fabsurplus.comfabsurplus.com
- [4]Lam Research Newsroom - Press Releases — newsroom.lamresearch.comnewsroom.lamresearch.com
Last updated Sep 22, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
