Fab Operation
MOSFETs, IGBTs, modules
Silicon power device fabrication: deep junctions, thick metallization, backside processing, and high-current test.
Lithography
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Ion Implantation
The Applied Materials / Varian VIISta HC Ion Implant is an ion implantation system.
The Varian 350D is a medium current ion implanter that was the tool of choice for semiconductor doping in the early 1980s.
The Axcelis 6200 A is an ion implanter that accepts 6-inch wafers and supports automatic recipe loading.
The Applied Materials / Varian VIISta 810 XEri is an ion implanter described as a 12-inch medium current system.
The Applied Materials / Varian E 500 HP is an implanter described as a medium current ion implantation system for 8-inch wafers.
Thermal / Diffusion
Drive-in diffusion pairs with implant dose planning
The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.
The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.
YES-3TA is a Vacuum Bake / Vapor Prime system in the YES Vacuum Bake/Vapor Prime product line, with capacity for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers.
The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.
The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.
Etch
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.
Deposition
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Dicing & Grinding
Thin-wafer handling pairs with taping/bonding support
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Takatori MWS 610 SD is a wire saw for dicing applications, introduced in 2017.
The Disco DAD 3350 is an automatic dicing saw.
Assembly / SMT
The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.
Juki IFS NX Programming Station is a programming station that includes a Juki Feeder Setup Jig.
The Electrovert Vectra Wave Soldering Machine is a lead-free, nitrogen-capable wave soldering system with a maximum PCB conveyor width of 18 inches (457 mm).
Packaging & Bonding
MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.
The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.
The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.
The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.
The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The Keysight MSOX 4154 A is a mixed signal oscilloscope with 1.5 GHz bandwidth, 5 GSa/s sampling rate, and 4 channels.
Keysight / Agilent M 9037 A is a PXIe embedded controller.
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