Disco
The Disco DAD3240 Automatic Dicing Saw is a compact, manual, precision dicing saw with automatic function. The Disco DAD3240 is used for cutting semiconductor wafers into individual chips or dies. The Disco DAD3240 can handle pieces from 1 inch to 8 inches in size and up to 650 mm in width.[1]
Plate 01Disco DAD3240 - Automatic Alignment
Plate 02Disco DAD 3240 Demo video
The Disco DAD3240 is used for cutting semiconductor wafers into individual chips or dies.[1][5]
The Disco DAD3240 can cut circular and rectangular pieces.[1][5]
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The maximum substrate size is 8 inch.[5]
The following facts about the DAD3240 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3240 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD3240 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD3240 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD3240 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD3240 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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