Takatori
The Takatori MWS 610 SD is a wire saw used for dicing semiconductor materials. The Takatori MWS 610 SD features a high rocking angle of ±3°, a 24-gallon slurry supply tank with pump and agitator, and load cell electronic control.[1][2][3][4][5]

Wire saws are machines used to slice ingots of brittle materials into thin wafers. The Takatori MWS 610 SD is a wire saw of this class.
Wire saws are typically used in the wafer manufacturing process after ingot growth and before further processing such as grinding and polishing. The Takatori MWS 610 SD is used in this step.
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The following facts about the MWS 610 SD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 610 SD are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MWS 610 SD are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MWS 610 SD are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MWS 610 SD are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MWS 610 SD is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 26, 2026.
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