Disco
3220
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing. The Disco 3220 is located in the University of Utah Nanofab and can be used with standard or UV tape.[1][2][3]
How it works
The Disco 3220 uses a blade assembly, spindle lock, blade maintenance functions, and a blade breakage detector during setup and operation.[5]
The Disco 3220 SOP includes initialization, blade replacement, blade parameter entry, spindle access, torque-controlled blade installation, and blade breakage detector adjustment.[5]
Applications
The Disco 3220 is used for wafer dicing with standard tape or ultraviolet tape.[1][2][3]
What do the numbers mean?
Power & electrical1
Performance1
Configuration & options7
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Spindle output1.5 kW at 30,000 min-1[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 3220 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3220 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3220 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3220 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3220 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3220 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]https://www.nanofab.utah.edu/wp-content/uploads/2022/08/tool-list.pdf — nanofab.utah.edunanofab.utah.edu
- [2]https://www.nanofab.utah.edu/wp-content/uploads/2020/04/NF-tool-list-April-2020.pdf — nanofab.utah.edunanofab.utah.edu
- [3]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [4]semistarcorp.comsemistarcorp.com
- [5]https://www.nanofab.utah.edu/wp-content/uploads/2024/03/Disco-DAD-3220-Dicing-Saw-SOP.pdf — nanofab.utah.edunanofab.utah.edu
Last updated Aug 13, 2026.
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