Disco
3240 Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco 3240 is a dicing saw for semiconductor wafer singulation. The tool is also known as the Disco DAD 3240.[1]
What it is
How it works
General reference — not yet source-verifiedA dicing saw operates by mounting the wafer on a tape frame held on a vacuum chuck. A high-speed rotating blade, typically diamond-impregnated, is moved across the wafer along predefined streets to cut the die. Coolant water is directed at the cutting zone to remove debris and dissipate heat.
The saw table moves the wafer in the X and Y axes under the blade while the spindle rotates at high speed. Precision linear motors and encoders control positioning to maintain saw kerf width and alignment.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor backend processing, dicing is performed after wafer backgrinding and before die attach or packaging. The wafer is thinned to the target thickness, then mounted on dicing tape before being loaded into the saw.
Applications
General reference — not yet source-verifiedDicing saws are used to singulate integrated circuits, LEDs, MEMS, and other devices fabricated on semiconductor wafers. The process is also applied to compound semiconductors and glass or ceramic substrates used in microelectronics.
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Disco 3240 Dicing?
The Disco 3240 Dicing is a dicing saw for semiconductor wafer singulation.[1]
Not publicly documented
The following facts about the 3240 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 3240 Dicing are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3240 Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3240 Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3240 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3240 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]3240 Dicing — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
- [3]Disco DAD 3240 Dicing Saw (A# 73944) - YouTube — youtube.comyoutube.com
Last updated Oct 7, 2026.
Compare with similar tools
View all →
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
