Tokyo Electron
Unity II E 85 DPA Dry
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Tokyo Electron Unity II E 85 DPA Dry is a dry etching system used in semiconductor manufacturing. The model designation designates it as belonging to Tokyo Electron's Unity II platform family, configured for 200 mm (8 inch) wafer processing. The system is categorized as an etch tool, performing dry (plasma-based) etching processes.[1][2]
How it works
General reference — not yet source-verifiedDry etchers in the Unity II class use plasma generated from reactive gases to remove material from a wafer surface. The plasma is created in a vacuum chamber, where radio-frequency (RF) power energizes process gases to produce ions and radicals. The ions are directed toward the wafer to perform anisotropic etching, while the radicals provide chemical etching. The system likely includes endpoint detection and process control features common to production etch tools from this era.
What do the numbers mean?
Wafer handling1
Configuration & options3
- Refurbished[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Unity II E 85 DPA Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unity II E 85 DPA Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Unity II E 85 DPA Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Unity II E 85 DPA Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Unity II E 85 DPA Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Unity II E 85 DPA Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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