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Lam Research

2300 Flex 45

EtchLam Research 2300 family
Research Quality: 50% complete
2300 Flex 45 — Inventory photo
Fig. 012300 Flex 45Inventory photo[1]

What it is

The Lam Research 2300 Flex 45 is a semiconductor etch system.[1]

How it works

General reference — not yet source-verified

An etch system removes selected material from a wafer by exposing it to process gases in a controlled chamber environment.

A chamber-based etch tool typically combines gas delivery, vacuum handling, and process control so the wafer surface can be acted on in a repeatable way.

Where it fits in the process flow

General reference — not yet source-verified

The Lam Research 2300 Flex 45 belongs in the pattern-transfer stage of semiconductor manufacturing, where exposed materials are removed after a masking step has defined the intended geometry.

Etch tools commonly follow lithography and precede downstream cleaning, stripping, or additional process steps in an integrated fabrication flow.

Applications

The Lam Research 2300 Flex 45 etcher uses C4F8, CF4, and CH3F for insulating film processing, and Cl2 and BCl3 for metal processing.[1]

What do the numbers mean?

Gas & chemistry3

Gases Used:[1]
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Gases used for insulating film
C4F8, CF4, CH3F[1]
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Gases used for metal
Cl2, BCl3[1]
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Configuration & options15

Metal HP MWS[1]
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3 Chambers
Insulating Film / Metal / Ashing[1]
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Insulating Film (C4F8, CF4, CH3F)[1]
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Metal (Cl2, BCl3)[1]
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Loadport (3)[2]
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EFEM[2]
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VTM[2]
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PM (3)[2]
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RPDB[2]
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AC Rack[2]
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Make
Lam[1]
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Model
2300 Flex 45[1]
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Equipment type
Etcher[1]
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Chambers
3 chambers[1]
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Process coverage
Insulating film / Metal / Ashing[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationGases Used:[1]
  • Gases used for insulating filmC4F8, CF4, CH3F[1]
  • Gases used for metalCl2, BCl3[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 2300 Flex 45 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Flex 45 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 2300 Flex 45 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 2300 Flex 45 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 2300 Flex 45 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 2300 Flex 45 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]inventory listing
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Last updated Oct 9, 2026.

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