Comparison ledger
Lam Research 2300 Flex 45, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 Flex 45Lam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Oxford Instruments 100 ICP Fluorine |
| Specifications | ||
| Configuration | Metal HP MWS[1] | — |
| 3 Chambers | Insulating Film / Metal / Ashing[1] | — |
| Make | Lam[1] | — |
| Model | 2300 Flex 45[1] | — |
| Equipment type | Etcher[1] | — |
| Chambers | 3 chambers[1] | — |
| Process coverage | Insulating film / Metal / Ashing[1] | — |
| Gases used for insulating film | C4F8, CF4, CH3F[1] | — |
| Gases used for metal | Cl2, BCl3[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[3] |
| Cryo DRIE etch rate | — | up to 5 µm/min[3] |
| Wafer size | — | 4 inch, 6 inch, 8 inch (with clamp change)[3] |
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