Hitachi
M 712 M 711 Dry Etch Process
The Hitachi M 712 / M 711 Dry Etch Process is an etch system for 12-inch wafers. The Hitachi M 712 / M 711 Dry Etch Process can be configured with a bipolar ESC and a Hitachi EPD monitor for endpoint detection. The Hitachi M 712 / M 711 Dry Etch Process includes a gas panel and supports a range of process gases.[1][2]
What it is
How it works
The Hitachi M 712 / M 711 Dry Etch Process uses an electrostatic chuck with a bipolar type, an endpoint monitor, an EC source generator, an EC bias generator, and an EC TMP controller.[2]
Where it fits in the process flow
General reference — not yet source-verifiedDry etch equipment sits in the pattern-transfer portion of the fab flow, where it works after lithographic patterning and before later device finishing steps.
The Hitachi M 712 / M 711 Dry Etch Process belongs in a wafer-etch process module rather than in deposition, metrology, or inspection.
Applications
General reference — not yet source-verifiedDry etch chambers are used for plasma-based pattern transfer on semiconductor wafers.
What do the numbers mean?
Power & electrical4
Wafer handling1
Gas & chemistry3
Control & software3
- 3203LMC-K1 EC TMP Controller[2]
Configuration & options18
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| M 712 / M 711 | — | 2006–2006 | Variant with gas configuration and ESC type Bipolar | Equipment inventory listing[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationDAIHEN ES7-IIA EC Source generator[2]
- ConfigurationPEARL CF-500-400K EC Bias generator[2]
- ConfigurationGas configuration:[2]
- Source generatorDAIHEN ES7-IIA EC Source generator[2]
- Bias generatorPEARL CF-500-400K EC Bias generator[2]
- Gas configurationLine / EC1 / Strip - 1 / Ar - 2 / C12 - 3 / SF6 - 4 / HBr - 5 / CF3 - 6 / CH4 - 7 / NF3 - 8 / O2 - 9 / N2 - 10/ SF6 - 11/ C12 - 12/ O2[2]
- Gas panel includedYes[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the M 712 M 711 Dry Etch Process are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the M 712 M 711 Dry Etch Process are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the M 712 M 711 Dry Etch Process are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the M 712 M 711 Dry Etch Process are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the M 712 M 711 Dry Etch Process is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the M 712 M 711 Dry Etch Process are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
Last updated Oct 11, 2026.
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