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Comparison ledger

200 ACUversusM 712 M 711 Dry Etch Process

Axcelis 200 ACU, Hitachi M 712 M 711 Dry Etch Process, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisHitachi
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Hitachi M 712 M 711 Dry Etch Process
Cited variants—
  • M 712 / M 711[1]
Specifications
ConfigurationParts Machine[2]Gaspanel included[6]
ManufacturerAxcelis[2]—
Model200 ACU[2]—
Tool typeAsher[2]—
Wafer size200mm[4]12 inch[6]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
Software revision—1.07 PMv.02.16M[6]
ESC Type—Bipolar[1]
Endpoint type—Hitachi EPD monitor ePMv02.16M[1]
TMP—SHIMAZU EC TMP[1]
TMP controller—3203LMC-K1 EC TMP Controller[1]
Source generator—DAIHEN ES7-IIA EC Source generator[1]
Bias generator—PEARL CF-500-400K EC Bias generator[1]
Gas configuration—Line / EC1 / Strip - 1 / Ar - 2 / C12 - 3 / SF6 - 4 / HBr - 5 / CF3 - 6 / CH4 - 7 / NF3 - 8 / O2 - 9 / N2 - 10/ SF6 - 11/ C12 - 12/ O2[1]
Gas panel included—Yes[6]
Vintage—2006[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]inventory listing