Tokyo Electron
The Tokyo Electron LITHIUS Pro is a 300mm wafer coater-developer for semiconductor lithography. The LITHIUS Pro supports ArF immersion, ArF, KrF, and i-line lithography processes. The LITHIUS Pro V variant achieves a maximum throughput of 250 wph.[1][2][3]

Performance
200 wph (upgradeable to 250 wph)[1]
Gas delivery
Coater / Developer[4]
Optics
With Rinse process at pre-/post exposure[4]
The Tokyo Electron (TEL) CLEAN TRACK LITHIUS Pro is a resist coater and developer used in semiconductor lithography processing. The LITHIUS Pro handles 300 mm wafers. The system is designed for immersion lithography processes. The LITHIUS Pro includes a rinse process applied before and after exposure.[4][3]
The LITHIUS Pro is a piece of equipment used in the lithography process, one of the core front-end wafer fabrication steps. The coater-developer is placed upstream and downstream of the exposure tool: it coats wafers with photoresist before exposure and develops the latent image after exposure. The system typically operates inline with a stepper or scanner, forming a lithography cell.
TEL announced the new CLEAN TRACK LITHIUS Pro DICE in December 2025.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| CLEAN TRACK LITHIUS Pro V | — | — | No differences from the base line stated in the source beyond the variant designation. | web.archive.org[1] |
| CLEAN TRACK LITHIUS Pro V-i | — | — | No differences from the base line stated in the source beyond the variant designation. | web.archive.org[1] |
| LITHIUS Pro V | — | — | High-productivity platform with 200 wph throughput upgradeable to 250 wph; optimized integration with exposure tool. | web.archive.org[1] |
| LITHIUS Pro V-i | — | — | Variation of LITHIUS Pro V; details not specified in sources. | web.archive.org[1] |
| LITHIUS Pro-i | — | — | Listed alongside LITHIUS Pro; likely a variant with i-line optimization. | web.archive.org[1] |
| LITHIUS Pro DICE | — | 2025 | Announced December 2025; features defect control technology reducing resist coating defects by 50% or more; world-class productivity; improved environmental performance. | tel.com[2] |
| LITHIUS Pro Z | — | — | Previous model provided for over a decade; preceded LITHIUS Pro DICE. | tel.com[2] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The LITHIUS Pro is configured for 300 mm wafers.[3]
The following facts about the Lithius Pro are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the Lithius Pro are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Lithius Pro are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Lithius Pro is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Lithius Pro are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Lithius Pro are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Last updated Oct 5, 2026.
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