Waferpedia

Comparison ledger

150 e MaskversusLithius Pro

SUSS MicroTec 150 e Mask, Tokyo Electron Lithius Pro, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
Lithius ProTokyo Electron
OEMSUSS MicroTecTokyo Electron
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2025 Announcement of LITHIUS Pro DICE
Control system——
Generation——
FamilySUSS MicroTec 150 e MaskTokyo Electron Lithius
Cited variants—
  • CLEAN TRACK LITHIUS Pro V[1]
  • CLEAN TRACK LITHIUS Pro V-i[1]
  • LITHIUS Pro V[1]
  • LITHIUS Pro V-i[1]
  • LITHIUS Pro-i[1]
  • LITHIUS Pro DICE[2]
  • LITHIUS Pro Z[2]
Specifications
Configuration—Immersion COT and DEV[3]
Equipment type—Coater / Developer[3]
Process description—Immersion COT and DEV[3]
Pre-/post-exposure process—With rinse process at pre-/post exposure[3]
FOUP exchanger—1 FOUP exchanger[3]
Application—Lithography process (ArF Immersion, ArF, KrF, i-line)[1]
Throughput—Maximum 250 wph capable in future; 200 wph capability with future upgradeability to 250 wph[1]
Integration—Optimized integration with the exposure tool for maximizing litho cell throughput[1]
Chemical consumption—Drastically reduced chemical consumption[1]
Wafer Size—300mm[2]
Throughput (LITHIUS Pro V)—200 wph (upgradeable to 250 wph)[1]
Applications—ArF Immersion, ArF, KrF, i-line lithography[1]
Date of Manufacture (example unit)—2010-04-15[4]
Software Version (example unit)—300.0.88.3[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]tel.comtel.com
  3. [3]inventory listing
  4. [4]macquarie.commacquarie.com