Lam Research
TCP 9400 DFM Poly
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What is it?
What do the numbers mean?
Power & electrical1
Gas & chemistry1
Control & software1
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[1]
- Tungsten silicide (WSix) etch capability
- Tungsten silicide (WSix)
- 8"
- Transport Module / TCP 9400 DFM-P Modules for Tungsten Silicide Etch
- Brooks Automation Mag 7
- PM2 - TCP9400DFM-P - Wsix Etch
- PM3 - TCP9400DFM-P - Wsix Etch
- PM4 - TCP9400DFM-P - Wsix Etch
- ESC - Anodized Aluminum
- Interferometer EP - PM2, PM3 & PM4
- Enhanced Universal Gas box - 12 Stick
- Dry Pumps: Busch DS80 Cobra (3) and Busch BB100 (2)
- Chillers: TCU - Edwards 40/80 Plus (3) - RPM
- Voltage SAG Enhanced
- Software: A4.0-37VM
- Power: 50/60 Hz, 3 Phase, 4 Wire
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the TCP 9400 DFM Poly are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TCP 9400 DFM Poly are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TCP 9400 DFM Poly are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TCP 9400 DFM Poly are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TCP 9400 DFM Poly are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TCP 9400 DFM Poly is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 24, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
