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Lam Research

R 4420 XL Poly

EtchLam Research R 4420 XL Poly family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

General reference — not yet source-verified

Poly etchers are specialized semiconductor manufacturing systems that remove polysilicon layers from wafers using chemical or plasma etching processes.

How it works

General reference — not yet source-verified

The etching process is controlled by adjusting parameters such as chamber pressure, RF power, and gas flow rates to achieve uniform material removal.

Where it fits in the process flow

General reference — not yet source-verified

Poly etching is typically performed after the deposition of polysilicon layers in the wafer fabrication process. The etched wafer then proceeds to cleaning and subsequent processing steps.

Applications

General reference — not yet source-verified

Polysilicon etching is employed in the manufacture of various semiconductor devices, including memory chips, microprocessors, and other integrated circuits where poly layers are used.

The process is also applied in the production of microelectromechanical systems (MEMS) and photovoltaic cells that require etching of poly layers.

What do the numbers mean?

Wafer handling1

Wafer Sizes
6, 8 inch[1]
Accurate?

Configuration & options3

OEM
Lam[1]
Accurate?
Type
Poly Etcher[1]
Accurate?
Vintage
1994[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the R 4420 XL Poly are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the R 4420 XL Poly are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the R 4420 XL Poly are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the R 4420 XL Poly are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the R 4420 XL Poly are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the R 4420 XL Poly is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
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Last updated Oct 2, 2026.

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