Lam Research
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The Lam 2300 Exelan Flex is a dielectric etch system. The Lam 2300 Exelan Flex is designed for sub-90nm technology nodes. The Flex variant adds a 60MHz ICP source for low-k etch at sub-65nm nodes.[1][2][3][4]
The 2300 Exelan Flex uses a radio-frequency (RF) inductively coupled plasma (ICP) source. The Flex variant operates with a 60 MHz ICP, while related variants use a 13.56 MHz source. The RF matching network is a component of the RF delivery system.[1]
The dielectric etch step typically follows the deposition of an insulating layer and the patterning of a photoresist mask that defines the areas to be removed. After etching, the remaining mask is stripped, and the wafer proceeds to subsequent manufacturing stages.
The 2300 Exelan Flex is used for etching dielectric materials including silicon dioxide, silicon nitride, and low-k dielectrics.[1]
Documented failure modes, common issues, and field considerations.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2300 Exelan HP (High Productivity) | — | — | Uses 13.56MHz ICP source with 3000W max power; ideal for oxide etch at 90nm. May lack 60MHz ICP for low-k etch. | caladansemi.com[1] |
| Exelan Classic (pre-2005) | — | — | Pre-2005 variant; lacks sub-100nm uniformity. Avoid for sub-100nm nodes. | caladansemi.com[1] |
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The Lam Research 2300 Exelan Flex is a semiconductor manufacturing tool classified as a dielectric etch system.[2][3][1]
The Exelan Flex uses an inductively coupled plasma (ICP) source. The Flex variant adds a 60 MHz ICP.[1]
Maintained components in the vacuum chamber include the chamber liners, the e-chuck, heater coils, and the heater plate.[5]
The system is used for etching oxide, nitride, and low-k dielectric materials.[1]
The following facts about the 2300 Exelan Flex Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Flex Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2300 Exelan Flex Dielectric are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2300 Exelan Flex Dielectric is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2300 Exelan Flex Dielectric are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2300 Exelan Flex Dielectric are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 2, 2026.
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