Applied Materials
VIISta HE XP
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The VIISta HE XP is an ion implantation system produced by Applied Materials (formerly Varian Semiconductor Equipment). The VIISta HE XP is a high-current implanter.[1][2]
How it works
General reference — not yet source-verifiedIon implanters generate a beam of dopant ions from a source gas, accelerate the ions to a desired energy, and then scan the beam across the wafer surface to achieve a uniform implanted dose. High-current implanters typically use a ribbon beam or a spot beam that is mechanically scanned across the wafer to achieve high throughput.
Where it fits in the process flow
General reference — not yet source-verifiedIon implantation is a critical step in the fabrication of integrated circuits, typically performed after photolithography and before annealing. High-current implanters are used for source/drain doping, polysilicon gate doping, and other high-dose applications that require heavy concentrations of dopants.
Applications
General reference — not yet source-verifiedThe primary application of high-current ion implanters is for high-dose doping of silicon wafers in CMOS logic and memory device fabrication. Typical implanted species include boron, phosphorus, and arsenic for p-type and n-type doping.
What do the numbers mean?
Wafer handling2
Configuration & options6
- High Current[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Axcelis GSD 200 E 2 High Current— Same function class: Ion Implantation, nullCompare in depthsource[2]
- Varian Viision 200— Same function class: Ion Implantation, nullCompare in depthsource[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the VIISta HE XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the VIISta HE XP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the VIISta HE XP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the VIISta HE XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the VIISta HE XP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the VIISta HE XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]fabsurplus.com — fabsurplus.comfabsurplus.com
Last updated Sep 1, 2026.
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The Axcelis GSD 200 E 2 is a high current implanter with source-stated wafer sizes of 6 inch and 8 inch.
The Varian Viision 200 (also spelled VIISion 200) is a batch-process, high-current ion implanter for 200 mm wafers, introduced in 1996.
The Varian 0216 7696, E 11368072 ESC is an electrostatic chuck (ESC) platen of the ADV-S type, categorized under ion implantation equipment.
