Varian
0216 7696, E 11368072 ESC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedAn electrostatic chuck platen operates by applying a high DC voltage between electrodes embedded in the chuck and the wafer, creating an attractive electrostatic force that clamps the wafer in place.
The electrostatic clamping force allows the wafer to be firmly held without physical contact, enabling efficient heat transfer from the wafer to the platen through a thin gas layer or direct contact.
Where it fits in the process flow
General reference — not yet source-verifiedThe electrostatic chuck platen is part of the end station of an ion implanter, the chamber where wafers are loaded and processed.
In the process flow, wafers are transferred into the end station, clamped onto the platen, exposed to the scanned ion beam, then unclamped and sent to the next process step.
Applications
General reference — not yet source-verifiedThe platen is used in all types of ion implantation processes for semiconductor device fabrication, including high-current, medium-current, and high-energy implants.
Applications include source/drain doping, well formation, threshold voltage adjustment, and other doping steps where precise dose and energy control are required.
What do the numbers mean?
Configuration & options3
- Platen ADV-S Type[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 0216 7696, E 11368072 ESC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 0216 7696, E 11368072 ESC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 0216 7696, E 11368072 ESC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 0216 7696, E 11368072 ESC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 0216 7696, E 11368072 ESC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 0216 7696, E 11368072 ESC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Sep 23, 2026.
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