Axcelis

GSD 200 E 2 High Current

Ion Implantation Axcelis GSD 200 family

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GSD 200 E 2 High Current — Inventory photo — Fig. 01GSD 200 E 2 High CurrentInventory photo^[1]

What it is

The Axcelis GSD 200 E 2 is a high-current ion implanter for semiconductor manufacturing.^[1]^[2]^[7]^[4]

How it works

General reference — not yet source-verified

An ion implanter accelerates dopant ions into a semiconductor wafer to change the electrical properties of near-surface regions.

A high-current implanter class is used when a fabrication flow needs substantial dopant throughput for implantation steps.

Where it fits in the process flow

General reference — not yet source-verified

The tool belongs downstream of wafer preparation and upstream of subsequent process modules that complete the implanted device region.

What do the numbers mean?

Power & electrical2

High Voltage Transformer: both Oil/Light^[2]
Options: Accel-Highvoltage Probe installed, HPES-Upgrade installed^[2]

Wafer handling3

Handler System: Arm (Non HPES), In Air Handler^[1]
Wafer Size: 8 inch^[1]
Wafer Size: 6 inch^[4]

Control & software6

Software Version: VM 8.0 (Virtual Machine)^[1]
Factory Interface: None^[1]
Software Version: 6.4.3 (no license included)^[2]
CIM Interface: SECs^[1]
Software Version: 6.4.3^[2]
Kit Cell Controller: 177^[2]

Configuration & options21

CIM: SECs^[1]
Process: B11, BF2, As, P^[1]
Option System: Silicon Disk, SEF EGUN^[1]; Blade Server 120006095C Excluded^[1]; AsH3, BF3^[2]; Refurbished^[2]; CE Marked^[2]; HPES-Upgrade installed, but upgrades were stopped after HPES-Upgrade^[2]; Missing:^[2]; Clean-Room Table on frontside - 0.5L Xe-Plasma-Bottle Holder + Terminal Water Cover^[2]
Process Species: B11, BF2, As, P^[1]
Process Species: AsH3, BF3^[2]
Vintage: 2001^[1]
Vintage: 1995^[2]
Disk Drive: Direct-Drive^[2]
Dose Type: Regular^[2]
Source Type: ELS4 IHC-Source without Vaporizer^[2]
Main Workstation: SUN Solaris AXI 3HE (special case)^[2]
Second Workstation: SUN Sparc5 on cart with printer^[2]
Tower Color: red/yellow/green; no buzzer^[2]
Network: 24-port 100MB Ethernet with Cisco Router^[2]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
GSD 200 E 2	—	—	One source states 8 inch wafer size and lists software, CIM, process, handler, factory interface, and option details; another source states 6 inch wafer size.	Equipment inventory listing^[1]

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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Varian Viision 200 Ion— Same function class: Ion Implantation, nullCompare in depthsource^[1]
Varian Viision 200— Same function class: Ion Implantation, nullCompare in depthsource^[1]
Varian E 500 High Current— Same function class: Ion Implantation, nullCompare in depthsource^[1]
Varian E 500 EHPI Ion Implant— Same function class: Ion Implantation, nullCompare in depthsource^[1]
Applied Materials VIISta Plad High Current— Same function class: Ion Implantation, nullCompare in depthsource^[5]
Applied Materials VIISta HE XP— Same function class: Ion Implantation, nullCompare in depthsource^[6]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

High Voltage Transformerboth Oil/Light^[2]
OptionsAccel-Highvoltage Probe installed, HPES-Upgrade installed^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What dopant species can the GSD 200 E 2 be configured to implant?

The implanter can be configured to implant B11, BF2, As, P, AsH3, and BF3.^[1]^[2]

What type of wafer handler does the GSD 200 E 2 use?

The handler system is an arm-based handler (non HPES) operating in air.^[1]

Not publicly documented

The following facts about the GSD 200 E 2 High Current are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GSD 200 E 2 High Current are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the GSD 200 E 2 High Current are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the GSD 200 E 2 High Current are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the GSD 200 E 2 High Current is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the GSD 200 E 2 High Current are on record.
Answerable by: an OEM parts catalog or a service engineer