Applied Materials
Applied Materials eMax CT Plus Dielectric is a dielectric etch chamber for semiconductor processing. Applied Materials eMax CT Plus Dielectric uses a bias of 13.5 MHz and 2 MHz LF, a 60 MHz Daihen source, and an Alcatel ATH 1600 M turbo pump. Applied Materials eMax CT Plus Dielectric includes an RF match box, an RF generator, and a Nor-Cal / NC-95-PP gate valve.[1][2]

Applied Materials eMax CT Plus Dielectric is configured with an Alcatel ATH 1600 M turbo pump, an RF match box, a bias supply at 13.5 MHz and 2 MHz, a Daihen RMN-50N1 low-frequency bias unit, a Daihen AMN-30 H 60 MHz source, a Nor-Cal NC-95-PP gate valve, eFib and wFib fiber options, and a chamber equipment cart.[1][2]
Applied Materials eMax CT Plus Dielectric sits in the etch portion of semiconductor manufacturing after film deposition and patterning steps that define where material is to be removed.
Applied Materials eMax CT Plus Dielectric supports dielectric etch processing rather than front-end wafer formation or back-end assembly.
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The following facts about the eMax CT Plus Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the eMax CT Plus Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the eMax CT Plus Dielectric are on record.
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The control-system platform and OS era of the eMax CT Plus Dielectric are not on record.
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No publicly documented failure modes or field errata for the eMax CT Plus Dielectric are on record.
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Last updated Oct 11, 2026.
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