Waferpedia

Comparison ledger

eMax CT Plus Dielectricversus200 ACU

Applied Materials eMax CT Plus Dielectric, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
eMax CT Plus DielectricApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials eMaxAxcelis NV GSD 200
Specifications
ConfigurationAlcatel ATH 1600 M Turbo Pump[1]Parts Machine[2]
Bias13.5 MHz (Bias) & 2 MHz (LF Bias)[1]—
LF BiasDaihen RMN-50N1[1]—
SourceDaihen AMN-30 H 60 MHz[1]—
Gate ValveNor-Cal / NC-95-PP[1]—
FIBeFib, wFib[1]—
Turbo PumpAlcatel ATH 1600 M[1]—
RF Match BoxIncluded[1]—
RF GeneratorIncluded[1]—
Chamber Equip CartIncluded[1]—
Manufacturer—Axcelis[2]
Model—200 ACU[2]
Tool type—Asher[2]
Wafer size—200mm[4]
Serial number—AU6A356AH[4]
Computer system—M 200 PC, M 200[5]
Part number—SC 4572 A[5]
Volts—208[5]
Amps—30[5]
Equipment type—Asher[2]
Wafer configuration—8 inch[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com