Applied Materials
The Applied Materials Centura DPS+ Poly Silicon is a 6-inch wafer etching system. The Applied Materials Centura DPS+ Poly Silicon includes wafer mapping. The Applied Materials Centura DPS+ Poly Silicon uses DPS Plus chambers at positions A, B, and D.[1][2]

Wafer size
Wafer Mapping
Power
208 VAC, 3 Phase, 60 Hz[1]
Vacuum
Alcatel STPA 2203 CV at positions A, B, D[2]
Gas delivery
Seriplex[1]
The Centura DPS+ Poly Silicon is configured for through-the-wall installation and uses a narrow-body load lock.[1]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Centura DPS+ Poly Silicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura DPS+ Poly Silicon are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura DPS+ Poly Silicon are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura DPS+ Poly Silicon are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura DPS+ Poly Silicon are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura DPS+ Poly Silicon is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
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