Tool family
The Applied Materials Centura is a semiconductor processing platform used for chemical vapor deposition (CVD) and etching.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Ultima+ HDP | — | 2002 | — | Equipment inventory listing[1] |
| 3 C/H, DxZ | — | 2000 | — | Equipment inventory listing[2] |
| SIGEN 4CH | — | — | — | Equipment inventory listing[3] |
| Centura CVD (Chemical Vapor Deposition) | — | 2000 | Listed with product details including 8" Ultima+ HDP, 8" 3 C/H DxZ, and 12" SIGEN 4CH. | Equipment inventory listing[1] |
| Centura Etcher | — | 2003 | Listed as an etcher variant with 12" wafer size and EMAX CT Plus. | Equipment inventory listing[4] |
| Centura CVD Ultima+ HDP | — | 2002 | 8-inch CVD configuration; described as Ultima+ HDP with 2002 vintage. | Equipment inventory listing[1] |
| Centura CVD DxZ | — | 2000 | 8-inch CVD configuration; described as 3 C/H DxZ with 2000 vintage. | Equipment inventory listing[2] |
| Centura Etcher EMAX CT Plus | — | 2003 | 12-inch etch configuration; described as 3 C/H EMAX CT Plus with 2003 vintage. | Equipment inventory listing[4] |
| Centura CVD SIGEN 4CH | — | — | 12-inch CVD configuration; described as SIGEN 4CH. | Equipment inventory listing[3] |
The Applied Materials Centura 4.0 DPN is a Decoupled Plasma Nitride deposition system designed for 12-inch wafers and configured as a Gate Stack tool.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura 4.0 DPN Plus Chamber | — | — | — | fabsurplus.com[5] |
Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.
Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.
Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura AP Enabler E5 | — | 2010 | Dielectric Etcher with 4 process chambers; Fab Interface type: Centura Etch 5.3 FAC; Frame 5.3 Fi Rev 002 | fabsurplus.com[6] |
The Applied Materials Centura DPS+ is an etch system for 200 mm (8 inch) wafers with multiple chamber configurations.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura DPS | — | — | Identified in the sources as a Centura DPS Etcher; one source notes chambers only, no loadport, with 9 chambers listed as 4 incomplete but okay condition and 5 parts. | Equipment inventory listing[7] |
The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.
Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.
Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.
The Applied Materials Centura eMax Nitride is an etch system configured for 8-inch wafers with two eMAX chambers and an orienter/degas module.
The Applied Materials Centura eMXP+ is an etch tool for 8-inch wafers, configured for oxide and nitride spacer processes, with a 208 VAC electrical supply and software version E4.8_26.
Applied Materials Centura Enabler Oxide Etcher is an oxide etcher from Applied Materials.
Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2002 Vintage | — | 2002 | The source states this example is a 2002 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH. | Equipment inventory listing[10] |
| Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2000 Vintage | — | 2000 | The source states this example is a 2000 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH. | Equipment inventory listing[11] |
The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.
The Applied Materials Centura II is a dry etch tool used in semiconductor processing, configured with DPS+Metal process modules and supporting 6-inch wafers. The tool is from circa 2001.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura II | — | — | Listed with configuration option DPS + Metal. | waferpedia.com[12] |
Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.
The Applied Materials Centura Super E is an 8-inch etch system with three chambers and wide body loadlocks.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Applied Materials Centura is a semiconductor processing platform used for chemical vapor deposition (CVD) and etching.
The Applied Materials Centura 4.0 DPN is a Decoupled Plasma Nitride deposition system designed for 12-inch wafers and configured as a Gate Stack tool.
Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.
Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.
Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.
The Applied Materials Centura DPS+ is an etch system for 200 mm (8 inch) wafers with multiple chamber configurations.
The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.
Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.
Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.
The Applied Materials Centura eMax Nitride is an etch system configured for 8-inch wafers with two eMAX chambers and an orienter/degas module.
The Applied Materials Centura eMXP+ is an etch tool for 8-inch wafers, configured for oxide and nitride spacer processes, with a 208 VAC electrical supply and software version E4.8_26.
Applied Materials Centura Enabler Oxide Etcher is an oxide etcher from Applied Materials.
Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.
The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.
The Applied Materials Centura II is a dry etch tool used in semiconductor processing, configured with DPS+Metal process modules and supporting 6-inch wafers. The tool is from circa 2001.
Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.
The Applied Materials Centura Super E is an 8-inch etch system with three chambers and wide body loadlocks.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.