Applied Materials
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A decoupled plasma nitride deposition system uses a plasma source to create reactive species for nitride film growth while separating major process controls so plasma generation and wafer-bias conditions can be adjusted independently. A deposition tool of this class applies thin films to a wafer surface inside a controlled process chamber.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura 4.0 DPN Plus Chamber | — | — | — | fabsurplus.com[3] |
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The following facts about the Centura 4.0 DPN are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura 4.0 DPN are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Centura 4.0 DPN are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura 4.0 DPN are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura 4.0 DPN is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura 4.0 DPN are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 3, 2026.
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