Comparison ledger
Applied Materials 0010 47763, Applied Materials Centura DPS+ Poly Silicon, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Centura DPS+ Poly SiliconApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | Wafer Mapping |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Centura |
| Specifications | ||
| Configuration | 2nd Source New[1] | Through the Wall[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | Centura DPS+[4] |
| OEM | Applied Materials[1] | Applied Materials[4] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Voltage | — | 208 VAC, 3 Phase, 60 Hz[4] |
| Full Load Current | — | 250 A[4] |
| Maximum System Rating | — | 90 KVA[4] |
| Rating of LArgest Load | — | 175 A[4] |
| Software Version | — | 4.8_26[4] |
| Wafer size | — | Wafer Mapping[4] |
| Load Lock Type | — | Narrow Body[4] |
| Robot Type | — | HP+[4] |
| Gas Panel Type | — | Seriplex[4] |
| System Controller | — | 5200 only[4] |
| Wafer sizes | — | 6 inch[4] |
| System configuration | — | Position A: DPS Plus, Position B: DPS Plus, Position D: DPS Plus, Position F: Wafer Orienter[4] |
| Voltage/Phase | — | 208 VAC, 3 Phase, 60 Hz[4] |
| System controller | — | 5200[4] |
| ESC type | — | Polyimide[4] |
| Upper chamber part number | — | 0010-13833[4] |
| Throttle valve part number | — | 0016-39645[4] |
| Turbo chamber positions | — | Alcatel STPA 2203 CV at positions A, B, D[5] |
| RF microwave generators | — | ACG-6B-02, ATLAS 2012 at positions A and B[5] |
| Heat exchanger | — | AMAT 1, quantity 2[5] |
| Vintage | — | 1997[4] |
| Position A | — | Chamber Type DPS Plus[4] |
| Position B | — | Chamber Type DPS Plus[4] |
| Position D | — | Chamber Type DPS Plus[4] |
| Position F | — | Chamber Type Wafer Orienter[4] |
| Throttle Valve P/N | — | 0016-39645[4] |
| Category | — | Etch[5] |
| Wafer mapping | — | Yes[4] |
| Power | — | 208 VAC, 3 Phase, 60 Hz[5] |
| Electrostatic chuck | — | Polyimide[4] |
| Through the wall | — | Yes[4] |
| All cables present | — | Yes[4] |
| Independent backside HE cool | — | Yes[4] |
| Signal lamp tower | — | Yes[4] |
| Remote service monitors | — | Yes[4] |
| Position A chamber type | — | DPS Plus[5] |
| Position B chamber type | — | DPS Plus[5] |
| Position D chamber type | — | DPS Plus[5] |
| Position F chamber type | — | Wafer Orienter[5] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →