DSC300 Gen2

Projection lithography systems project a mask pattern onto a photoresist-coated substrate through an optical system. The DSC300 Gen2 uses full-field scanning projection, where the mask and substrate move in a synchronized scanning motion during exposure. The system performs substrate alignment prior to exposure to ensure pattern placement accuracy. The equipment includes automated handling for substrates up to 300 mm. The DSC300 Gen2 belongs to the class of ultraviolet (UV) projection exposure tools used in semiconductor manufacturing.^[1]

The DSC300 Gen2 is used in backend lithography processes, often for advanced packaging and wafer-level processing. In a typical process flow, the machine receives a substrate after coating and baking steps and exposes it with the desired pattern. After exposure, the substrate moves to developing or etching steps to complete the pattern transfer. The system's scanning projection capability is suited for patterning larger substrates in a production environment. The tool is suitable for process sequences that demand automated substrate handling and alignment for high-volume manufacturing.^[1]

The DSC300 Gen2 is applied in advanced packaging processes, including redistribution layer (RDL) patterning and through-silicon via (TSV) formation. The equipment also supports manufacturing of microelectromechanical systems (MEMS) devices. The system can be used in LED manufacturing, where projection lithography helps define device structures. The tool is suitable for processes requiring fine feature definition on substrates up to 300 mm, common in wafer-level packaging and 3D integration. The system's capabilities also extend to general back-end lithography applications for compound semiconductor and packaging industries.^[1]