Sumitomo
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The machine's direct-drive injection unit delivers controlled screw rotation and reciprocation to plasticize and inject the molding compound, with the nozzle contacting the mold under selectable force of 1200 or 1500 kgf.[3]
In semiconductor packaging, injection molding machines encapsulate wire-bonded or flip-chip devices with thermosetting epoxy molding compound, forming the final protective package body.
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The clamping force is 75 tonf.[3]
The machine is available with plasticizing unit options designated C110S, C160S, and C250M.[3]
Dimensions are 4247 mm x 1059 mm x 1719 mm for the C110S and C160S versions, and 4247 mm x 1059 mm x 1800 mm for the C250M version.[3]
The maximum opening stroke is 300 mm.[3]
Injection capacity ranges from 40 cm³ to 143 cm³ depending on the screw diameter and plasticizing unit selected.[3]
The following facts about the SE 75 DUZ Injection are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 75 DUZ Injection are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE 75 DUZ Injection are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE 75 DUZ Injection are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE 75 DUZ Injection are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE 75 DUZ Injection is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 24, 2026.
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