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Comparison ledger

0041-26723 Bonded AssemblyversusSE 75 DUZ Injection

Applied Materials 0041-26723 Bonded Assembly, Sumitomo SE 75 DUZ Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsSumitomo
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblySumitomo SE 75 DUZ Injection
Specifications
Make—Sumitomo[1]
Model—SE 75 DUZ[1]
Asset #—143846[1]
Category—Packaging & Bonding[2]
Clamping force—75 tonf[3]
Distance between tie-bars—410 x 360 mm[3]
Open daylight (max.)—710 mm[3]
Machine type—Electric[4]
Tonnage—75[4]
Injection unit—C160[4]
Shot size—1.7 oz[4]
Series designation—SE75DUZ-HD High-Duty (Metric Units) Direct-Drive All-Electric[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]onlinestore.dpg.comonlinestore.dpg.com
  4. [4]pnaplastics.compnaplastics.com