Waferpedia

Comparison ledger

1 WBS 1 Wafer SubstrateversusSE 75 DUZ Injection

Logitech 1 WBS 1 Wafer Substrate, Sumitomo SE 75 DUZ Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMLogitechSumitomo
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateSumitomo SE 75 DUZ Injection
Specifications
Wafer Size6 inch[1]—
Make—Sumitomo[2]
Model—SE 75 DUZ[2]
Asset #—143846[2]
Category—Packaging & Bonding[3]
Clamping force—75 tonf[4]
Distance between tie-bars—410 x 360 mm[4]
Open daylight (max.)—710 mm[4]
Machine type—Electric[5]
Tonnage—75[5]
Injection unit—C160[5]
Shot size—1.7 oz[5]
Series designation—SE75DUZ-HD High-Duty (Metric Units) Direct-Drive All-Electric[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]onlinestore.dpg.comonlinestore.dpg.com
  5. [5]pnaplastics.compnaplastics.com