Onto Innovation
NSX 330 B
The Onto Innovation NSX 330 B is an inspection system. The Onto Innovation NSX 330 B supports three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The Onto Innovation NSX 330 B can accommodate 100mm to 330mm whole wafers.[1][2]
Wafer size
Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
Optics
Programmable illumination filter wheel[1]
What it is
How it works
The NSX 330 B uses a programmable illumination filter wheel and multiple modes of dark field illumination. The NSX 330 B supports three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer.[1][2]
The NSX 330 B includes an objective turret with five available slots and supports objective choices from 1X through 50X. The NSX 330 B also includes recipe sharing, a recipe server, and Discover software database results archiving.[1][2]
Where it fits in the process flow
The NSX 330 B fits in inspection and review steps used to find defects and assess wafer condition during semiconductor manufacturing. The NSX 330 B can be used with edge and backside modules for all-surface inspection.[1][2]
The NSX 330 B supports inspection of MEMS, Taiko, and thin wafers. The NSX 330 B also supports extreme warpage greater than 12 mm and ultra-thin wafers below 50 µm.[1][2]
Applications
The NSX 330 B is used for wafer inspection, defect review, and results archiving in semiconductor production flows. The NSX 330 B is also used for tool matching and recipe sharing.[1][2]
The NSX 330 B is configured for multiple inspection platforms with hard-anodized finishes. The NSX 330 B supports three simultaneous color defect review methods and dark field inspection.[1][2]
What do the numbers mean?
Wafer handling4
- Wafer size
- Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[1]
- Choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers[1]
- Inspection modes
- Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[2]
Optics & imaging7
Control & software4
Configuration & options12
- Programmable light tower[1]
- Standard docking module[1]
- Teams with edge and backside modules for all-surface solution[1]
- Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)[1]
- Tool matching[1]
- HDD not included[1]
- Handling
- Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)[1]
- Options
- Programmable light tower; standard docking module; teams with edge and backside modules for all-surface solution; unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm); tool matching[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes can the NSX 330 B accommodate?
The NSX 330 B can accommodate whole wafers from 100 mm to 330 mm.[2][1]
What defect review modes does the NSX 330 B support?
The NSX 330 B supports three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer.[2][1]
Not publicly documented
The following facts about the NSX 330 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 330 B are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 330 B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 330 B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 330 B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 330 B is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Inventory photo
Last updated Oct 10, 2026.
Compare with similar tools
View all →The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.
