Onto Innovation

The Onto Innovation / Nanometrics HL 5500 is a Hall Effect Measurement System for semiconductor characterization.

The ONTO / Rudolph S 3000 S is a focused beam laser ellipsometry tool.

The Onto Innovation NSX 105 Macro Defect is a macro defect inspection system for 300 mm wafers.

The Vertex PL Mapping system is a mapping system manufactured by Onto Innovation (formerly Nanometrics) with a production vintage range of 2007 to 2011.

Onto Innovation 4Di is a product family listed under the company’s Metrology category.

The NanoSpec 6100 is an automated film thickness measurement system designed for measuring films on semiconductor and magnetic head substrates.

The Nanometrics NanoSpec AFT 4150 is a visible-light reflectometry system for non-contact thin film thickness measurement on semiconductor wafers and flat substrates.

The Onto Innovation AXI 935 Macro Defect is a metrology and inspection tool for macro defect detection on 8-inch and 12-inch wafers.

The ONTO / Rudolph MP 1 300 is a 300 mm wafer film thickness measurement tool.

The MetaPulse 200 X Cu Film Metrology is an ONTO / Rudolph metrology tool for copper film measurement.

The NSX 115 Auto Defect is a metrology and inspection tool from Onto Innovation.

The NSX 320 + SWS + WHS Macro Defect Inspection is a macro defect inspection tool.

The Onto Innovation / Rudolph AXI 930 is a macro inspection system that detects wafer-level and die-level defects on wafers up to 8 inches.

The Onto / Applied Precision PrecisionWoRx VX 4 is a system featuring 3000 non-Kelvin channels, an M60 6:1 zoom microscope, and multiple load cells and checkplates.

The Onto / Rudolph WV 320 is an inspection system.

The ONTO / Rudolph MP 200 XCU Cu Film Thickness Measurement is a copper film thickness measurement tool for 8-inch wafers.

The Onto Innovation / Rudolph Sonus 7800 is an acoustic metrology and defect detection system for 300 mm wafers.

The Nanospec AFT 4000 is a scanning UV thickness measurer that handles 8-inch wafers and was manufactured in 1996.

The MP 200 is a film thickness measurement tool from Onto Innovation, also identified under the combined maker name ONTO / Rudolph, documented in an 8-inch wafer configuration.

The Onto Innovation / Rudolph / August NSX 105 Rev D is a wafer inspection system.

The Onto / Nanometrics NanoSpec 8000 X is a film thickness measurement system stated to be configured for 6-inch wafers.

The 3000 Tabletop Thin Film Analysis System is an ONTO / Nanometrics equipment model.

The Nanospec 9100 Thickness Measuring is an ONTO / Nanometrics thickness measuring tool.

The ONTO / Rudolph MetaPulse 200 C is a film metrology tool.

The Onto Innovation (formerly Rudolph) MP 1 200 supports 12-inch wafers.

The MetaPulse II 200 X CU is a film thickness measurement tool for 8-inch wafers, manufactured by Onto Innovation (formerly Rudolph).

The NSX 105 Wafer Bomping is a metrology and inspection tool from Onto Innovation.

The ONTO / Rudolph / August NSX 100 is an inspection system.

The Onto Innovation / Rudolph F 30 is a semiconductor equipment tool that supports 12-inch wafers.

The MP 300 is a metal film thickness measurement tool designed for 12-inch wafers.

The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.

The Nanospec AFT 180 Metrology tool is a Metrology & Inspection instrument manufactured by Onto Innovation and supports 6-inch wafers.

The Nanospec 210 is a thin film measurement system used in semiconductor process control.

The Vanguard S 2000 is a thin film measurement instrument manufactured by Onto Innovation (formerly Rudolph).

The Onto / Rudolph MetaPulse 200 is a film metrology tool for 8-inch wafers.

The Nanospec 3000 is a film thickness measurement system that uses spectro-reflectometry to determine the thickness and refractive index of transparent films on substrates.

The Onto Innovation / Rudolph Metapulse 300 CU is a metal film measurement system for 12-inch wafers.

The Onto Innovation / Rudolph MetaPulse 200 C is a film thickness measurement system for 8-inch wafers.

The Onto Innovation 210 (also known as ONTO / Nanometrics 210) is a semiconductor manufacturing equipment model.

The NSX 115 is an inspection system in the Metrology & Inspection category.

The IVS 380 System performs overlay, CD, and height metrology for 300mm wafers.

The Onto Innovation Matrix S 200 is an inspection and measurement tool introduced in 2008.

The Onto Innovation IVS 280 System provides overlay, CD, and height metrology for 100mm to 200mm wafers in compound semiconductor, power devices, RF, MEMS, and LED markets.

The Onto Innovation Nanospec 9300 Film Analysis is a spectroscopic reflectometer for thin film thickness measurement.

The Onto Innovation Nanospec 9310 Thickness Measuring is a thickness measuring tool.

The Onto Innovation NSX 85 is an automatic wafer and die defect inspection tool categorized under Metrology & Inspection.