Lam Research

Chemical vapor deposition (CVD) systems deposit thin films on semiconductor wafers through chemical reactions of gaseous precursors. CVD tools are a core part of front-end-of-line and back-end-of-line fabrication. The equipment class includes reactors that provide controlled temperature, pressure, and gas flow to achieve uniform film growth.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Triple Speed NF | — | 2008 | Triple Speed NF configuration with WTS IMM handler, modules at ports 2-4, Brooks ATR 8 front-end robot, and Brooks Mag 7 TM robot. | Equipment inventory listing[1] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Concept Three Speed are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept Three Speed are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Concept Three Speed are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept Three Speed are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept Three Speed is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Concept Three Speed are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 3, 2026.
Applied Materials Centura 5200 Metal is a CVD deposition system stated to support 8-inch wafers.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.