EV Group
6200 NT Semi Automated Bottom Side Alignment
The EV Group 6200 NT Semi Automated Bottom Side Alignment System is a mask alignment system for optical double-side lithography. The EV Group 6200 NT Semi Automated Bottom Side Alignment System supports wafer sizes up to 200 mm. The EV Group 6200 NT Semi Automated Bottom Side Alignment System has bottom side alignment specified at ≤ ± 1.0 µm.[1][2]
What it is
How it works
The EVG 6200 NT uses manual or automatic alignment modes, contact or proximity exposure modes, and wedge compensation for alignment control. The EVG 6200 NT also includes integrated vibration isolation and software-controlled alignment functions.[1]
The EVG 6200 NT uses a mercury light source or UV LED light source. The EVG 6200 NT supports interval exposure, flood exposure, and sector exposure.[1]
Where it fits in the process flow
General reference — not yet source-verifiedMask alignment belongs in optical lithography before pattern transfer to the wafer surface. A bottom side alignment tool is used when registration must be made to backside features, when double-side lithography is required, or when wafer condition makes precise alignment more difficult.
Applications
The EVG 6200 NT is used for optical double-side lithography. The EVG 6200 NT is also used for exposure of thin and thick resists, patterning of deep cavities and comparable topographies, and processing of thin and fragile materials such as compound semiconductors.[1]
What do the numbers mean?
Vacuum & pumping2
Wafer handling4
Optics & imaging3
Performance4
- Throughput
- Up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode[1]
Control & software4
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 6200 NT Semi Automated Bottom Side Alignment are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6200 NT Semi Automated Bottom Side Alignment are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6200 NT Semi Automated Bottom Side Alignment are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6200 NT Semi Automated Bottom Side Alignment are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6200 NT Semi Automated Bottom Side Alignment are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6200 NT Semi Automated Bottom Side Alignment is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]Inventory photo
Last updated Oct 10, 2026.
Compare with similar tools
View all →Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
