Applied Materials

Plate 01AMAT P5000 PECVD Nitride 2 Chambers
The Applied Materials Precision 5000 Etcher uses independently controlled chambers, and chambers A, B, and C are magnetically enhanced reactive ion etch systems with optical endpoint detection.[2]
The chamber configuration and system software support control over a wide range of process parameters.[2]
Documented failure modes, common issues, and field considerations.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the P 5000 Cluster are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 5000 Cluster are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 5000 Cluster are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 5000 Cluster are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the P 5000 Cluster is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the P 5000 Cluster are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 8, 2026.
The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.
The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.
The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.