Ulvac
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The Ulvac SRH 530 is a sputtering system for 4-inch wafers manufactured in 2013.[1]
The Ulvac SRH 530 is a sputtering system produced by Ulvac.[1]
In sputtering systems, a plasma is generated in a low-pressure gas atmosphere.
Ions from the plasma bombard a target material, ejecting atoms that deposit onto a substrate placed opposite the target.
Sputtering systems are used in the deposition step of semiconductor fabrication.
Sputtered films serve as conductive layers, diffusion barriers, or seed layers for subsequent electrochemical deposition.
Sputtering systems are employed to deposit a wide range of materials including metals such as aluminum, copper, titanium, and tantalum, as well as oxides like silicon dioxide and indium tin oxide.
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The following facts about the SRH 530 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the SRH 530 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SRH 530 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SRH 530 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SRH 530 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SRH 530 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 27, 2026.
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