Tokyo Electron
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A wafer prober positions a wafer precisely under a probe card that contains an array of fine needles. The prober makes electrical contact with the bond pads of each die on the wafer to enable testing of individual circuits before dicing. After each die is tested the prober steps to the next die location automatically.
Wafer probers are used after the completion of all front-end wafer fabrication steps and before the wafers are diced for packaging. The testing performed on a prober is often called wafer sort or electrical die sorting and it identifies good die for subsequent assembly. Defective die are either marked or mapped out of the process flow.
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The following facts about the P 8 XLm are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the P 8 XLm are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 8 XLm are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 8 XLm are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 8 XLm are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 8 XLm are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 23, 2026.