Tokyo Electron
Alpha 8 S
What it is
General reference — not yet source-verifiedThe Alpha 8 S belongs to the class of furnace-based thermal processing equipment used in semiconductor manufacturing. Thermal and diffusion tools are used to heat wafers in controlled atmospheres so that films, dopants, or oxide structures can be formed or modified.
How it works
General reference — not yet source-verifiedThermal and diffusion furnaces process wafers by exposing them to carefully controlled temperature profiles and process atmospheres. The process environment supports heat-driven reactions and material transport at the wafer surface and within the near-surface region.
In this equipment class, furnace loading and unloading are handled so that wafers can be exposed uniformly across a batch or process zone. The thermal cycle is used to drive reactions such as oxidation, annealing, densification, and dopant movement or activation.
Applications
General reference — not yet source-verifiedTools of this class are used for thermal treatment of silicon wafers during device fabrication. The class supports processes that modify electrical properties and dielectric structures through controlled heating.
What do the numbers mean?
Wafer handling1
Configuration & options20
- BBR3 DOPE[1]
- WELL DRIVE HT FIELD OX[2]
- D2 ANNEAL[3]
- DENSIFICATION[4]
- FSG ANNEAL[5]
- PADOX[7]
- POCL3[8]
- Vintage
- 1999(inventory listing)
- Vintage
- 1996(inventory listing)
- Vintage
- 1997(inventory listing)
- Vintage
- 1995(inventory listing)
- Vintage
- 2000(inventory listing)
- Vintage
- 1998(inventory listing)
- Furnaces / Diffusion Vintage
- 1999(inventory listing)
- Furnaces / Diffusion Vintage
- 1996(inventory listing)
- Furnaces / Diffusion Vintage
- 1997(inventory listing)
- Furnaces / Diffusion Vintage
- 1995(inventory listing)
- Furnaces / Diffusion Vintage
- 2000(inventory listing)
- Furnaces / Diffusion Vintage
- 1998(inventory listing)
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| BBR3 DOPE | — | 2010 | Listed as a Tel Alpha 8 S configuration for 8-inch wafers. | Equipment inventory listing[1] |
| WELL DRIVE HT FIELD OX | — | 1997 | Listed as a Tel Alpha 8 S configuration for 8-inch wafers. | Equipment inventory listing[2] |
| D2 ANNEAL | — | 1995 | Listed as a Tel Alpha 8 S configuration for 8-inch wafers. | Equipment inventory listing[3] |
| DENSIFICATION | — | 1996 | Listed as a Tel Alpha 8 S configuration for 8-inch wafers. | Equipment inventory listing[4] |
| FSG ANNEAL | — | 1996 | Listed as a Tel Alpha 8 S configuration for 8-inch wafers. | Equipment inventory listing[5] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of process does a thermal and diffusion system perform?General reference — not yet source-verified
It performs controlled heat treatment of wafers so that materials, dopants, or thin films change their physical and electrical properties in a predictable way.
Where is this class of machine used in fabrication?General reference — not yet source-verified
It is used in the wafer process flow after steps that create or place material that must be thermally modified, stabilized, or activated.
What is the main purpose of diffusion processing?General reference — not yet source-verified
The main purpose is to use heat to move dopants or other species within a semiconductor structure so that regions with the desired electrical behavior are formed.
Does this class handle only diffusion steps?General reference — not yet source-verified
No. Machines of this class are also used for annealing, oxidation, film densification, stress relief, and other heat-based process steps.
Why is thermal control important in this equipment class?General reference — not yet source-verified
Thermal control determines how far and how fast material changes occur, which directly affects junction formation, film quality, defect reduction, and device performance.
Not publicly documented
The following facts about the Alpha 8 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Alpha 8 S are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Alpha 8 S are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Alpha 8 S are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Alpha 8 S is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Alpha 8 S are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]inventory listing
- [4]inventory listing
- [5]inventory listing
- [6]Inventory photo
- [7]inventory listing
- [8]inventory listing
- [9]inventory listing
Last updated Oct 10, 2026.
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