Teradyne
Nextest Magnum PV SCM
The Teradyne / Nextest Magnum PV SCM Tester is a test system. The Teradyne / Nextest Magnum PV SCM Tester accepts an input of 200-240 VAC at 16 A and 50/60 Hz.[1]
What it is
How it works
General reference — not yet source-verifiedA test and probe instrument makes electrical contact to a device on a wafer or other substrate so the device can be evaluated before later processing steps.
A probe-based system typically positions probes, aligns them to device pads or structures, and connects the device under test to external test electronics.
Where it fits in the process flow
General reference — not yet source-verifiedA test and probe instrument fits into semiconductor evaluation between wafer fabrication and downstream assembly or further qualification.
A probe station in this class is used when devices must be contacted directly at the wafer stage rather than after singulation.
Applications
General reference — not yet source-verifiedA test and probe instrument is used for wafer-level electrical verification and for checking devices before they move to later manufacturing steps.
A probe-based tool of this type is used in semiconductor manufacturing and development when direct contact to device pads or test structures is required.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of devices can this test system handle?General reference — not yet source-verified
Test systems of this class are designed to be flexible and can handle a broad range of semiconductor devices, including analog, mixed-signal, digital, and power devices. The specific device types supported depend on the configuration of the test head and the available instrument modules.
How is the device connected to the tester?General reference — not yet source-verified
For wafer-level testing, the device is contacted using a probe card that matches the die's pad layout. For packaged devices, a test socket or handler interface is used. The test system's pin electronics provide electrical connections to each of the DUT's terminals.
What is the typical test throughput?General reference — not yet source-verified
Throughput depends on many factors including the number of tests performed, the test time per device, the parallelism of testing, and the speed of the prober or handler. Class-level test systems are capable of testing multiple devices simultaneously to improve throughput.
How accurate are the measurements?General reference — not yet source-verified
Measurement accuracy is a key specification for test systems of this class. The system is calibrated using known references and traceable standards. Accuracy depends on the specific instruments used (e.g., source-measure units, digitizers) and can be adjusted via the test program's measurement settings.
Not publicly documented
The following facts about the Nextest Magnum PV SCM are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nextest Magnum PV SCM are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Nextest Magnum PV SCM are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Nextest Magnum PV SCM are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Nextest Magnum PV SCM are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Nextest Magnum PV SCM is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Nextest Magnum PV SCM — Teradyne | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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