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SUSS MicroTec

MA 200

LithographySUSS MicroTec MA 200 family
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MA 200 — Inventory photo
Fig. 01MA 200Inventory photo[1]

Power

230 V[1]

Optics

Lens[1]

What it is

General reference — not yet source-verified

The SUSS MicroTec MA 200 is a lithography aligner used for mask alignment and exposure in semiconductor processing.

How it works

General reference — not yet source-verified

A mask aligner holds a photomask and a coated substrate in controlled registration so patterned light can transfer the mask image into photoresist.

Applications

General reference — not yet source-verified

The MA 200 is used for photolithographic patterning on semiconductor wafers.

What do the numbers mean?

Power & electrical2

Voltage
230 V[1]
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Frequency
50 Hz[1]
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Wafer handling2

Wafer sizes
6 inch[1]
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Wafer sizes
8 inch[3]
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Optics & imaging2

Lens[1]
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Referenced in process guidance
AZ P4000 Series exposure-dose guidance lists Suss MA-200 and gives approximate dose values of 1.5 μm = 90 mJ/cm2, 3.5 μm = 135 mJ/cm2, and 12 μm = 800 mJ/cm2[4]
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Control & software2

Focus Controller[1]
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Video Control Unit[1]
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Configuration & options11

3200 VA[1]
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Mirror 1, Mirror 2, Mirror 3[1]
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Lamp[1]
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Monitor[1]
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Display[1]
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Fixed Blaket[1]
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Cover[1]
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Cable Duct[1]
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Manufacturer
SUSS[1]
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Model
MA 200[1]
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Category
Aligner[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage230 V[1]
  • Frequency50 Hz[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What does a lithography system do?General reference — not yet source-verified

It transfers a pattern from a mask into a photosensitive layer on a substrate so that the pattern can be developed and used in later fabrication steps.

Where is this class used in process flow?General reference — not yet source-verified

It is used early in the fabrication sequence, after surface preparation and resist coating and before pattern transfer or material removal steps.

What kinds of processes use this class of machine?General reference — not yet source-verified

It is used in microfabrication processes that require precise feature definition, including electronic, photonic, and microstructured device manufacturing.

Why is alignment important in this class of equipment?General reference — not yet source-verified

Alignment ensures that the exposed pattern is registered correctly to existing features or to the substrate layout, which is essential for device accuracy and layer-to-layer overlay.

What is the main output of the lithography step?General reference — not yet source-verified

The output is a patterned resist image that serves as the template for the next manufacturing operation.

Not publicly documented

The following facts about the MA 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MA 200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MA 200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MA 200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MA 200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
  4. [4]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
  7. [7]AZ P4620 Positive Photoresist — ece.utoronto.caece.utoronto.ca
  8. [8]3D Lithography: SUSS MicroTec — suss.com (Jan 21, 2012)web.archive.org
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Last updated Oct 8, 2026.

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