Strasbaugh
6 EC
The Strasbaugh 6 EC (also marketed as the nSpire CMP system) is a chemical mechanical polishing tool used for planarization and sample preparation. The Strasbaugh 6 EC supports 3-inch and 4-inch (100 mm) wafers with fully programmable control of polishing parameters. The Strasbaugh 6 EC features a ViPRR carrier and Hydro-Lift load station to minimize contamination, and an advanced pad conditioning system with 20 programmable zones.[1]
How it works
The Strasbaugh 6 EC supports programmable sweep, downpressure, table speed, time, and slurry flow.[3]
Where it fits in the process flow
The Strasbaugh 6 EC is used for silicon and silicon dioxide polishing and planarizing at the University of Utah nanofabrication facility.[4]
Applications
What do the numbers mean?
Power & electrical9
Vacuum & pumping1
- Programmable controls
- fully programmable sweep, downpressure, table speed, time, slurry flow[3]
Wafer handling5
Control & software2
Configuration & options10
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Reflexion— Same function class: CMP, nullCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration50/60 Hz[2]
- Phase3 Phase[2]
- Voltage208 V[2]
- Configuration13.6 Motor Amps[2]
- Input voltage208 V[2]
- Frequency50/60 Hz[2]
- Motor amps13.6 A[2]
- Power50/60 Hz, 3 phase, 208 V[2]
- Motor current13.6 motor amps[2]
- Programmable controlsfully programmable sweep, downpressure, table speed, time, slurry flow[3]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- CMP PrimerDocumentcornell.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a CMP machine do?General reference — not yet source-verified
It removes material while flattening the surface, using a combination of abrasive slurry and controlled mechanical motion.
Why is planarization important?General reference — not yet source-verified
Planarization helps keep later process steps uniform by reducing surface height variation and making the work surface more level.
What is removed during CMP?General reference — not yet source-verified
Material is removed from the surface in a controlled way, often from higher areas first, so the overall topography becomes more even.
Where does CMP fit in manufacturing?General reference — not yet source-verified
It is used between fabrication steps when a surface must be made flat before additional layers or patterns are added.
What kinds of surfaces are processed by this class of tool?General reference — not yet source-verified
Machines of this class are used on semiconductor wafers and other precision substrates that need controlled flattening and finishing.
Not publicly documented
The following facts about the 6 EC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6 EC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6 EC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6 EC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6 EC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6 EC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]web.archive.org — strasbaugh.com (Jan 6, 2009)web.archive.org
- [2]Inventory photo
- [3]nanofab.ece.cmu.edu — nanofab.ece.cmu.edunanofab.ece.cmu.edu
- [4]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [5]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [6]patents.google.compatents.google.com
Last updated Oct 10, 2026.
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