Applied Materials
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The Applied Materials Reflexion is a chemical mechanical polisher (CMP) for semiconductor wafer polishing. The Applied Materials Reflexion CMP is built for processing 12-inch wafers. Applied Materials Reflexion units were configured for processing materials such as dielectric and oxide, copper, and metals including cobalt.[1][2][3]

The Applied Materials Reflexion is a chemical mechanical planarization (CMP) system used in semiconductor manufacturing. The Reflexion is designed for processing 12-inch wafers.[1][2][3]
In a typical CMP tool, a wafer is mounted on a rotating carrier head and pressed against a rotating platen covered with a pad. An abrasive slurry with reactive chemicals is dispensed between the pad and wafer. The combined chemical and mechanical action removes material at a controlled rate.
CMP is a critical step in front-end and back-end-of-line processing. The process is used after dielectric deposition to planarize interlayer dielectrics, and after metal deposition to remove overburden and form damascene interconnects.
CMP is used for planarization of oxide layers, copper damascene structures, and metal layers in advanced logic and memory devices.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Reflexion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Reflexion are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Reflexion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Reflexion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Reflexion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Reflexion are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 2, 2026.
The Strasbaugh 6 EC is a chemical mechanical polishing (CMP) tool with fully programmable process parameters, supporting wafer sizes including 3-inch and 4-inch (100 mm) wafers.
The SCREEN / DNS AS 2000 is a CMP (Chemical Mechanical Polisher) for 8-inch wafers.
The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.
The Strasbaugh 100R16 is a 1-spindle grinder/polisher with a DC drive system and 2 motors. The Strasbaugh 100R16 has a 16-inch capacity.