Pfeiffer
The Pfeiffer / Alcatel Adixen AMS 200 DRIE is a single-wafer deep reactive ion etch system for 8-inch wafers. The AMS 200 uses RF power of 5 kW and platen power of 3 kW. The AMS 200 supports process gases including Ar, O2, N2, C4F8, SF6, and He.[1]

Wafer size
Single-Wafer Chamber for Deep Silicon Etch
Power
400 V, 50/60 Hz, 3-Phase[1]
Vacuum
No[1]
Gas delivery
Ar, O2, N2, C4F8, SF6 & He[1]
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
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The RF power is 5 kW and the platen power is 3 kW.[1]
No, the system does not use cryogenic cooling; it is equipped with a standalone chiller.[1]
Yes, it has a single‑wafer chamber with an auto load/unload robot.[1]
The tool requires a 400 V, 50/60 Hz, three‑phase power input, with a 480 VAC tool feed and a 208 V, 500 A, three‑phase, four‑wire system supply.[1]
The following facts about the Alcatel Adixen AMS 200 DRIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Alcatel Adixen AMS 200 DRIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Alcatel Adixen AMS 200 DRIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Alcatel Adixen AMS 200 DRIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Alcatel Adixen AMS 200 DRIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Alcatel Adixen AMS 200 DRIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 23, 2026.
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