Waferpedia

OAI

6000

LithographyOAI 6000 family
Research Quality: 60% complete
6000 — web.archive.org
Fig. 016000web.archive.org[1]

What it is

The OAI 6000 is an automated front and backside mask aligner system for production use.[3]

How it works

General reference — not yet source-verified

A mask aligner is a lithography tool that brings a photomask and a substrate into alignment before exposure so a pattern can be transferred onto a light-sensitive layer.

An automated mask aligner generally uses controlled wafer handling, alignment optics, and exposure control to support repeatable pattern transfer on production substrates.

Where it fits in the process flow

The OAI 6000 integrated lithography cell includes coat, bake, align and expose, and develop functions in one linked system.[1]

Applications

The OAI 6000 is intended for production semiconductors, MEMS, sensors, advanced packaging, IoT, and microfluidics.[3]

  • Semiconductors
  • MEMS
  • Sensors
  • Advanced packaging
  • Microfluidics

What do the numbers mean?

Wafer handling5

Wafer flow
Allows for dynamic wafer flow and parallel application processing[1]
Accurate?
Wafer handling
Reduced wafer handling[1]
Accurate?
Wafer size capability
Multiple wafer sizes can be processed simultaneously[1]
Accurate?
Cluster configuration allows dynamic wafer flow and parallel application processing[1]
Accurate?
Wafer Size Support
Multiple wafer sizes can be processed simultaneously[1]
Accurate?

Optics & imaging2

Product class
Automated Front & Backside Mask Aligner[3]
Accurate?
Type
Automated Front & Backside Mask Aligner System / Integrated Lithography Cell[3]
Accurate?

Control & software1

Control interface
Single terminal for control over recipe and program selection; P9000 performs as the master user interface[1]
Accurate?

Dimensions & facilities1

Footprint
Small footprint[1]
Accurate?

Configuration & options9

Product name
Model C&D P9000 / OAI 6000: Integrated Lithography Cell[1]
Accurate?
System type
Integrated lithography cell[1]
Accurate?
Process steps
Coat | Bake | Align/Expose | Develop[1]
Accurate?
Manufacture
Fully manufactured in the USA[1]
Accurate?
Cluster configuration[1]
Accurate?
Operator requirement
Fewer operators needed in the lithography module[1]
Accurate?
Application area
For production semiconductors, MEMS, sensors, advanced packaging, IOT, microfluidics[3]
Accurate?
Capabilities
Coat, Bake, Align/Expose, Develop[1]
Accurate?
Country of Manufacture
USA[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What process steps are combined in the OAI 6000 integrated lithography cell?

The OAI 6000 integrated lithography cell combines coat, bake, align and expose, and develop functions.[1]

What type of aligner is the OAI 6000?

The OAI 6000 is an automated front and backside mask aligner system for production use.[3]

How is control handled on the OAI 6000 system?

The OAI 6000 uses a single terminal for control over recipe and program selection, and the P9000 performs as the master user interface.[1]

Not publicly documented

The following facts about the 6000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 6000 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 6000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 6000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 6000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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