Nikon
The Nikon SF 200 is an 8-inch wafer scanner with 0.18 µm resolution. The Nikon SF 200 uses a Komatsu laser and supports 6-inch reticles with a maximum exposure field of 26mm x 33mm.[1]

Plate 01Nikon Scanner Super Coolscan 4000 ED w Slide Feeder SF-200(S)
The Nikon SF 200 is a deep-ultraviolet step-and-scan lithography system. The system is designed for critical layer patterning in semiconductor manufacturing.
The Nikon SF 200 is a step-and-scan system that synchronously moves the reticle and wafer during exposure. A slit-shaped illumination field scans across the reticle, projecting the patterned image onto the wafer. The system uses an excimer laser as the light source. The deep-ultraviolet wavelength enables fine feature resolution.
The SF 200 is used in the lithography step of semiconductor fabrication, where photoresist-coated wafers are exposed to define circuit patterns. The SF 200 is typically employed for critical layers that require high resolution and overlay accuracy. In the process flow, the tool follows wafer cleaning and coating steps and precedes etching and deposition stages.
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Photolithography uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical (photoresist) on the wafer. The pattern is then etched into the underlying layers through subsequent processes.
Alignment is achieved by using optical microscopes or sensors to detect alignment marks on the wafer and the reticle. The system then precisely positions the stage to overlay the current exposure pattern onto previously formed structures.
Resolution is primarily limited by the wavelength of the exposure light, the numerical aperture of the projection lens, and the properties of the photoresist. Shorter wavelengths and higher numerical apertures allow finer features.
Temperature, humidity, vibration, and particulate contamination can all degrade image fidelity and overlay accuracy. Such systems are therefore operated in cleanroom environments with strict climate control.
Key attributes include high throughput (number of wafers processed per hour), consistent overlay accuracy across all exposures, low defect levels, and reliable operation over long periods. Automation and recipe management also contribute to production readiness.
The following facts about the SF 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SF 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SF 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SF 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SF 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SF 200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.
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