Waferpedia

Laurell

EDC-650-23

The Laurell EDC-650-23 B is a compact 650-series EDC spin processor from Laurell Technologies. The EDC-650-23 B accommodates up to Ø 150mm wafers and 5" x 5" (127mm x 127mm) substrates. The EDC-650-23 B has a 12,000 RPM capability with vacuum hold-down, but is recommended for only 3,000 RPM and non-vacuum chucks.[1][2][3][4]

EDC-650-23 — web.archive.org
Fig. 01EDC-650-23web.archive.org[1]

Wafer size

150mm

Power

95 to 240 VAC, 47/63 HZ, ~300 Watts[1]

Vacuum

12,000 RPM with vacuum hold-down[1]

What it is

The Laurell EDC-650-23 is a 650-series EDC spin processor. The system accommodates substrates up to 150 mm in diameter and 5 inch by 5 inch squares.[1][2][3][4]

How it works

The EDC-650-23 uses a 650-series microprocessor-based process controller that enables real-time operator interaction, including pausing and continuing a process. The process chamber is bowl-shaped with a clear dome lid. An adjustable down-flow exhaust and drain continuously monitors chamber atmospheric balance. The chamber is electrically interlocked to disable rotation and dispensing when the lid is open.[1][2][3][4]

Where it fits in the process flow

The EDC-650-23 supports etch, develop, and clean processes. A solvent or aqueous rinse and dry step typically follows these processes. The system can execute a bowl-wash and dry routine either within a process or independently.[1][2][3][4]

Applications

The EDC-650-23 is designed for processes including etch, develop, and clean. The system can be equipped with options such as back side rinse, dynamic linear or radial dispense, and heated chemistry for specific applications.[1][2][3][4]

  • Etch
  • Develop
  • Clean

What do the numbers mean?

Power & electrical1

Power
95 to 240 VAC, 47/63 HZ, ~300 Watts[1]2 sources
Accurate?

Vacuum & pumping6

Maximum rotational capability
12,000 RPM with vacuum hold-down[1]
Accurate?
Recommended rotational speed
3,000 RPM with non-vacuum chucks[1]
Accurate?
RPM capability
12,000 RPM with vacuum hold-down; recommended for only 3,000 RPM and non-vacuum chucks[1]
Accurate?
Vacuum
25–28 inches (~635–711mm) Hg of vacuum with a flow volume of 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg; 10 feet (300 cm) of 3/8 inch (~9.5 mm) outside diameter X 1/4 inch (~6 mm) inside diameter PE tubing provided[1]
Accurate?
Exhaust and drain
standard adjustable down-flow exhaust and drain; exhaust monitored by the process controller[1]
Accurate?
Chuck recommendation
exclusive use of non-vacuum chucks recommended with EDC systems[1]
Accurate?

Wafer handling4

Wafer capacity
Up to Ø 150 mm wafers[1]2 sources
Accurate?
Substrate capacity
Up to 5" × 5" (127 mm × 127 mm) substrates[1]2 sources
Accurate?
Substrate size
up to Ø 150mm wafers and 5" x 5" (127mm x 127mm) substrates[1]
Accurate?
High-performance drive
up to 12,000 RPM (depending upon the controller, chuck material, substrate size and mass)[2]
Accurate?

Gas & chemistry1

N2 Process/Seal Purge
60–70 PSIG (4–5 bar) of Nitrogen/CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour); 10 feet (300 cm) of 3/16 inch (~4 mm) inside diameter X 1/4 inch (~6 mm) outside diameter PE tubing provided[1]
Accurate?

Control & software1

Controller
650-series process controller; operator interaction in real-time during process execution including pausing time, stopping and continuing; field-updatable with downloadable firmware revisions; can be used with PC and Spin 3000 software, but PC not required[1]
Accurate?

Configuration & options6

Model
EDC-650-23[1]2 sources
Accurate?
Series
650-series EDC system[1]
Accurate?
Station mounted[1]
Accurate?
Housing material
typically solid co-polymer blend exclusive to Laurell Technologies; solid PTFE Hostaflon TFM-1600 / Teflon AF housing available[1]
Accurate?
Chamber top material
clear top made from ECTFE unless otherwise stated; ECTFE-coated 316 stainless steel screws used in some non-wetted areas[1]
Accurate?
Safety certifications
ETL certification, UL and CSA approval of components; CE and RoHS compliant[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
EDC-650-23 B——Listed as the station-mounted EDC-650-23 B version of the EDC system.web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Maximum rotational capability12,000 RPM with vacuum hold-down[1]
  • Recommended rotational speed3,000 RPM with non-vacuum chucks[1]
  • Power95 to 240 VAC, 47/63 HZ, ~300 Watts[1]
  • RPM capability12,000 RPM with vacuum hold-down; recommended for only 3,000 RPM and non-vacuum chucks[1]
  • N2 Process/Seal Purge60–70 PSIG (4–5 bar) of Nitrogen/CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour); 10 feet (300 cm) of 3/16 inch (~4 mm) inside diameter X 1/4 inch (~6 mm) outside diameter PE tubing provided[1]
  • Vacuum25–28 inches (~635–711mm) Hg of vacuum with a flow volume of 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg; 10 feet (300 cm) of 3/8 inch (~9.5 mm) outside diameter X 1/4 inch (~6 mm) inside diameter PE tubing provided[1]
  • Exhaust and drainstandard adjustable down-flow exhaust and drain; exhaust monitored by the process controller[1]
  • Chuck recommendationexclusive use of non-vacuum chucks recommended with EDC systems[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes can the EDC-650-23 handle?

The system accommodates substrates up to 150 mm in diameter and 5 inch by 5 inch (127 mm by 127 mm) squares.[1][2][3][4]

What is the maximum rotational speed?

The system has a 12,000 RPM capability with vacuum hold-down, but is recommended for only 3,000 RPM and non-vacuum chucks.[1][2][3][4]

What are the power requirements?

Power: 95 to 240 VAC, 47/63 Hz, approximately 300 Watts.[1][2][3][4]

What facility gas and vacuum are required?

Nitrogen or CDA at 60-70 PSIG (4-5 bar) is required for the motor seal and chamber purge, with consumption of 3 cubic feet per hour. Vacuum of 25-28 inches Hg with a flow volume of 4.5 SCFM at 0 inches Hg is suggested.[1][2][3][4]

What processes does the EDC-650-23 support?

Processes supported include etch, develop, and clean, typically followed by solvent or aqueous rinse, then dry.[1][2][3][4]

Not publicly documented

The following facts about the EDC-650-23 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EDC-650-23 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the EDC-650-23 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the EDC-650-23 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the EDC-650-23 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the EDC-650-23 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
  4. [4]EDC-650-23 Spin Coater - Laurell Technologies — images.laurell.comimages.laurell.com
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Last updated Sep 26, 2026.

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