Lam Research
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Common process applications include polysilicon and polycide etching as well as shallow trench isolation (STI) formation. The tool is also used for silicon nanocone and metasurface pattern transfer via reactive ion etching with chlorine and bromine chemistries.[1][4][5]
Vintage year 1996 as per serial #4055
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| TCP 9400 SE | — | 1996 | Model 9408, Rainbow platform, Envision v1.4, single chamber stand-alone, ceramic free chamber with waferless auto clean, 8-inch wafer size, cassette to cassette transport | photonicmicrodevices.com[1] |
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The tool uses chlorine (Cl2), hydrogen bromide (HBr), oxygen (O2), helium (He), nitrogen (N2), perfluoroethane (C2F6), and tetrafluoromethane (CF4) as process gases.[2]
The maximum etch depth is 3 micrometers for certain processes.[2]
The TCP 9400 uses a transformer coupled plasma (TCP) source, which is a form of inductively coupled plasma (ICP) generated by a planar coil operating at 13.56 MHz.[2][1]
The TCP 9400 is part of the Lam Research Rainbow platform.[1]
The following facts about the TCP 9400 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the TCP 9400 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TCP 9400 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TCP 9400 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TCP 9400 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the TCP 9400 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
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Last updated Sep 26, 2026.